Scorpion rework system now includes an automatic placement package capable of 50mm of motorized travel in the Z-axis and 360° in ϴ. Automatic placement package offers fine motor control in the Z-axis and ϴ during alignment of the component to the pad. Includes a force feedback control during the placement process, enabling the unit to pick and place components without disturbing the component or solder. Is now available in a Mobile version with a 1080p, high-def camera system that enables alignment and positioning of components before placement; is for use with smaller packages up to 25mm x 25mm. New digital controls have been implemented to control the light levels of the top and bottom LED lighting modules. Polarized filter feature is now standard. New upgrade kits include a side-view camera, contactless IR sensor, and thermal and airflow calibration kits.

Metcal, www.metcal.com 

SCPH silver conductive adhesive offers electrical conductivity and adhesion to most substrates, especially indium tin oxide and color filter substrates. Is reportedly not dissolved by Tuffy conformal coatings, which are frequently applied to the electrodes of flat panel displays. Can be coated with Tuffy alternately to simplify the assembly process. Can be used with fast-action, automatic dispensing equipment and cures at ambient temperatures within 10 min. Is halogen- and antimony-free, and requires no special storage conditions. For assembly of cellphone display modules, tablets and similar products that incorporate flat screen displays.

Electrolube, www.electrolube.com

GLRS laser singulation system is configurable with a near IR laser (1032nm) for use with metal-core substrates or a green laser (532 nm) for use with ultra-thin and flexible substrates. Inert gas injection at the Laser point minimizes local oxidation concerns, Particle/Gaseous remediation is affected from beneath. Vacuum is provided via two 5HP blowers and a three-stage filtration system capable of handling particles as small as 20 microns.

Getech, www.getechsys.com

LineMaster DM inspection machine has dual mode capability; incorporates SPI and AOI. Validates overall variables associated with component placement and solder paste printing. Detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and accurate and repeatable 3D volumetric measurements for SPI. Features include real-time SPC, customized data reports, offline CAD/Gerber programming and a defect repair station.

ASC International, www.ascinternational.com