Hybrid pick-and-place machine is capable of 7µm placement accuracy. Placement head carries one component at a time. Provides low-force closed-loop placement. Reportedly has placement defect rate < 1 dpm. Places up to 121,000 passives per hr. and up to 27,000 flip chips per hr. Controllable placement Z-axis can adapt placement height search algorithms for different heights, optimizing placement force for 2.5D mounting, package on package or embedded passive and active devices.

Assembléon, www.assembleon.com

2005 Zebra Connector is constructed from alternating layers of conductive carbon and nonconductive silicone as thin as 0.0004". Permits 500 conductive layers per inch. Is used to connect LCD displays directly to a printed circuit board with contact spacing as close as 0.010". Offers a carrying capacity of 50 mA per 0.040" x 0.040" pad; comes in widths ranging from 0.015" to 0.118" and lengths up to 9".

Fujipoly America Corp., www.fujipoly.com

Solder Mask Check Wipes seek out under-cured and porous solder resist. Can help identify conductive residues from HASL fluids causing electromigration or poor SIR values. Provides immediate color observation after 10 to 15 sec. of wiping bare or populated printed circuit boards. Can be used to pre-wipe bare PCBs to remove bleed from solder resist onto surface mount pads.

BLT Circuit Services, www.bltcircuitservices.co.uk/Scripts/default.asp

Thermadose hot melt production equipment provides pulse-free temperature-controlled thermoplastic dispensing for industrial applications, using pressure-sensitive adhesives, contact adhesives, waxes and sealants. Is suitable for direct-contact, non-woven, ribbon-coating, high-speed jetting and product assembly operations. Tank controllers include over-temperature and over-pressure protection. Includes independently controlled heat zones .Thermadose reservoir tanks are coated with inert Teflon heated by quick-change cartridges. Can be configured for use in manual and automated applications using a hand-valve or automated-valve applicator. Control settings are input using a touch pad. LED indicators monitor operation status and functions. Pail and drum melters handle hot melt EVA, PSA, and PUR, supplied from 5 gal. pails or 55 gal. drums. Melters include gear-pump technology providing pulse-free flow of adhesive.

Fisnar, www.fisnar.com