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New Products

USTFA acrylic conformal coating is VOC-free, low viscosity and said to facilitate and optimize selective coating. Improves adhesion on difficult substrates. UL94 V-0 flammability rated. Is fast drying and meets IPC-CC-830 requirements (UL746E pending). Also comes in bulk for manual application.

Electrolube, a division of H.K. Wentworth Ltd., www.electrolube.com

 

 

Factory Intelligence Monitoring Module allows users to leverage data available in the TTC platform to calculate and monitor key process indicators over time. Provides an understanding of how machines and assembly lines are running as well as information regarding causes for non-production and material losses.

Cogiscan, www.cogiscan.com

 

MicroLine 2000 SI laser depaneling system is for rigid and flexible printed circuit boards. Reportedly benefits from a low-stress UV laser beam. Is for removing bare or populated circuits from panels. Reportedly can process any board material, from FR4 to fired ceramics to flexible and rigid-flex substrates.

LPKF, www.lpkfusa.com

Leica DCM8 combined confocal and interferometric optical profiler is for nondestructive 3D surface profiling. Provides high-def confocal microscopy for high lateral resolution and interferometry to reach sub-nm vertical resolution. Provides lateral resolution up to 140nm and vertical resolution of up to 0.1nm. Employs confocal scanning technology without moving parts in the sensor head. Includes four LED light sources: blue (460nm), green (530nm), red (630nm), and white (centered 550nm); has an integrated CCD camera with XY topography-stitching mode.

Leica Microsystems, www.leica-microsystems.com/dcm8

BOMcheck conflict minerals web database provides an integrated tool for uploading EICC GeSI Conflict Minerals Reporting Templates with materials declarations for RoHS, REACH and other regulated substances. Validates data in EICC GeSI Conflict Minerals Reporting Template and provides immediate detailed feedback to correct data validation errors. Can be used to validate compliant smelters.

Environ, www.environcorp.com

CN-1735 underfill is designed to enhance thermal cycle performance of IC packages with pitches as fine as 0.3mm. Reportedly enhances ruggedness for drop and bend test performance. Has a CTE of 40 ppm/°C. Reportedly can be reworked using elevated temperature (170°C to 180°C) to remove underfill fillet.

Zymet, www.zymet.com

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