2500-MV turnkey SMT line features MC-400, a 64-feeder pick-and-place system with on-the-fly and bottom vision alignment and 2,500 cph placement of advanced SMDs from 0201 chip components to BGAs and 15 mil ultra-fine-pitch devices. Includes MC-110 manual stencil printer with a reported repeatability of ±0.02mm, and MC-301 batch benchtop reflow oven with programmable, Android-based preheat, soak, reflow, and cooling stages.  

Manncorp, www.manncorp.com/turnkeys

Atego Check automates project deliverables and reviews against predefined checklists. Initiates reviews automatically by live monitoring of computer disk folders, 15 different source code management systems, web pages, emails, dates and times, and QR codes. Reviews are automatically initiated and allocated to preauthorized Atego Check Reviewers, along with checklist, from a database of predefined and managed checklists. Reviews are comprised of lists of questions to be answered, stored and recorded with an electronic signature and timestamp. A management dashboard permits monitoring across tasks, projects, teams or programs. Works on PCs, tablets and smartphones. Has Off-WiFi/Network mode. Can build auditable checklists or choose from list of predefined safety-critical checklists.

Atego, www.atego.com 

RV-1 PWB automatic optical inspection and solder paste inspection machine inspects component mounting failures and solder printing failures. Compares PWB image data with data programmed in advance. Is equipped with 270mm large-diameter high-brightness white LED three-ring light and coaxial light. Twin linear motor, high-speed data transmission of CMOS camera and image processing library enables image shooting at 0.14 sec./frame. 3-D images synthesized from images shot with angle camera can be displayed for a final visual check. Software compares inspection images from multiple production lines.

Juki Americas, www.jukiamericas.com

BiAgX high-melt lead-free (Pb-free) solder paste is a drop-in replacement for standard high Pb-containing solder pastes. Is for small, low-voltage QFN packages used in portable electronics (smartphone/tablet), automotive electronics, and industrial applications. Is said to perform in at temperatures in excess of 150°C. Reportedly requires minimal process adjustments from standard high Pb-containing solder paste-based processes. Has passed MSL1 and thermal cycle testing at several power semiconductor customers. Is said to reflow, solder, wet and solidify like other solder pastes. Comes in dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.

Indium, www.indium.com/BiAgX