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New Products

NanoSlic Gold stencil, for solder paste printing, has a coated stencil underside and aperture walls, making them highly hydrophobic and oleophobic in order to repel solder paste. Coating is thermally cured and permanent, and said to improve solder paste transfer efficiencies for small apertures, resulting in higher yields and less rework. reportedly minimizes bridging and reduces underside cleaning. Is compatible with current assembly equipment and processes.

FCT Assembly, www.fctassembly.com

VPH100 PCB holders, for double-sided probing of printed circuit boards, feature quick-release levers, coarse adjustment screws and magnetic bases for secure grip on PCBs ranging from 2" to 18" in the vertical position for double-sided probing applications. Are benchtop-sized. Magnetic, stackable design can be reconfigured for testing boards in diverse form factors without the need of any additional tool.

PacketMicro, www.hsprobe.com

ESM-200 multifunctional magazine handling system is configured for front-of-line, end-of-line or middle-of-line. Works as a line loader, line unloader or magazine rack buffer (LIFO or FIFO), and can handle post-AOI sorting or act as a pass-through conveyor. Automatic width adjustment option facilitates product changeover. Comes in four sizes. Intuitive touch panel for configuration as needed. Roller wheels permit easy movement throughout the factory without use of fork lift or hand truck.

Promation, www.Pro-mation-Inc.com

 

Fine-L-Kote High Viscosity AR acrylic conformal coating is said to have a high viscosity for use as-is for dipping, or to thin for spray systems. Protects against moisture, thermal cycling, dust, debris, and other environmental contamination. Certified to IPC-CC-830B, MIL-I-46058C, and UL94 V-0, qualifying the final cured coat as nonflammable.

Techspray, a division of Illinois Tool Works, www.techspray.com

XM8000 wafer x-ray metrology platform reveals optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. Provides nondestructive, inline wafer measurement of voiding and fill levels, overlay and critical dimensions.

Nordson DAGE, www.nordsondage.com






Spherolyte RDL / Pillar 2 process for high-speed plating of copper pillars and redistribution layers (RDLs) is a sulfuric acid-based three additive copper electrolyte system. Nonuniformity value – within wafer, die or/and profile – of the deposited copper structures, even over a range of applied current densities, is up to 17.5 ASD  (3.9 µm/min). Process control is analyzable through an online system for all additives. Is for flip-chip applications for various sizes of copper pillars (including µ-Pillars), especially for handhelds such as tablets or smartphones.

Atotech, atotech.com

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