New Products
Kapton SMT plastic film stencils reportedly permit clean and precise hole patterns. Come in 4, 5 and 6 mil thicknesses. Present flat coplanar printing surfaces for solder paste printing. Are designed for prototype assembly, and the pitch of the components is one or above. Absorb heat of laser-cutting process without producing ridges.
BEST Inc., www.solder.net
RX-6 high-speed compact modular mounter places components ranging from subminiature components to large ICs or odd-shaped parts. Is equipped with head units that pick components and place them on PWBs on both the rear and front sides; head units on the front and rear sides repeat picking up and placing components. IC component height and PWB size are increased; can support production such as mounting of LEDs or PoPs. Includes placement monitor analyze function.
RX-7 mounter places subminiature components on PWBs at high speed. Includes two super rotary heads equipped with 16 nozzles for picking up/placing each component on a PWB. Achieves 75,000 cph. Parallel head configuration is used for the heads. Camera inside head detects tombstoning or component absence.
Juki, www.jukiamericas.com
Coolspan thermally and electrically conductive adhesive film is thermosetting, epoxy-based, and silver-filled. Is used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. Can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. Is supplied in sheet form on a PET; is reportedly easy to handle when converting into preforms and when peeling from the carrier. Withstands Pb-free solder processing. Offers chemical resistance and high-temperature performance.
Rogers Corp., www.rogerscorp.com
Large/heavy PCB and backplane handling equipment features 10mm wide positive track ESD belts (capped to 3mm edge contact). Capable of transporting up to 40 lb. PCB and backplane panels ranging up to 30" in width and 36" in length. Options include vertical buffering, turns, accumulation and more.
Promation, www.Pro-mation-Inc.com
DF2400 C-SAM acoustic microscope reportedly has 2x to 7x faster throughput than previous systems. Is automated and convertible to perform laboratory analysis. Can inspect ICs and flip chips in JEDEC-style trays or in metal carriers; inspects lead frame strips, IGBT power modules and other components. Throughput is reportedly doubled by incorporating two transducers and two simultaneous scanning stages. Two inertially balanced linear motor scanners reduce vibration and achieve scanning of ±0.5µm. Perform reflection-mode and Thru-Scan mode imaging. Uses non-immersion technology to minimize water exposure; can continuously control quality of water. Software makes acoustic images of up to 100 selected depths within a sample during a single scan. SECS-II/GEM E30 and SMEMA compatible.
Sonoscan, www.sonoscan.com
PCBGRIP electronics assembly system holds printed circuit boards in place to aid in the speed of assembly. Flexible, modular design is said to simplify a variety of electronics assembly tasks, including holding through-hole components (even upside down) in place during soldering; holding SMT stencils during paste application, and holding components in place. Permits PCB to be rotated, tilted, swung around, or raised/lowered.
PCBGrip, www.pcbgrip.org
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri