Aquanox A4708 is said to rapidly clean under densely populated, low-gap PCB assemblies and is reportedly effective on all flux types, including no-clean and water-soluble residues. Is pH neutral, formulated for enhanced metal compatibility, and safe for delicate gold and aluminum bonding pads. Provides bright solder joints, even after multiple wash exposures. Comes in one, five and 55 gal. containers.
Kyzen, www.kyzen.com
C-SAM model DF2400Z automated acoustic micro imaging system images and analyzes IGBT module defects. Incorporates inverted transducer. Once a recipe for scanning has been defined, the factory automation interface controls the operation. A conveyor loads two IGBT modules onto the two system stages.
Two ultrasonic transducers raster-scan each module. Ultrasound is pulsed into the module. Echo signals are received from gap-type defects. Accepts and rejects are stacked in separate locations. Accept/reject criteria are written by the user. Acoustic images reveal what type of rework is needed. Finds gap-type defects. Can image tilting and warping of module elements such as rafts.
Sonoscan, www.sonoscan.com
Tension stainless steel is designed for surface mount stencil printing. Is hardened to withstand high-tension applications, as well as traditional and frameless mounting. Reportedly rivals cutting and print performance of FG alloy.
Datum Alloys, www.datumalloys.com
OM-535 is a low-temperature solder paste designed to enable a single reflow application for assembly of double-sided printed circuit boards. Has excellent no-solder drip during reflow. With SBX02 alloy and a melting point below 140°C, it has been used with peak reflow profiles between 155°C and 190°C. Flux residue provides excellent electrical resistivity. Eliminates extra wave or selective wave soldering process when temperature-sensitive through-hole components are used. Eliminates need for managing bar solder, wave soldering flux supplies, and pallets. Allows desired obsolescence of an extra SMT process.
Alpha, http://alpha.alent.com/
Has thermal conductivity of more than 10 BTU in/ft2•hr•°F with excellent electrical insulation properties. Is for potting, bonding, sealing and coating applications. Can be used in larger potting applications; has low exotherm when curing. Low coefficient of thermal expansion (CTE), enhanced dimensional stability, a high modulus and superior compressive strength properties.
Master Bond, www.masterbond.com
EP30P two-component epoxy offers adhesion to a variety of substrates. Suitable for bonding glass, polycarbonates and acrylics. Is an electrical insulator. Has low viscosity for encapsulating and potting. Produces high strength, rigid bonds resistant to water, oil, acids and many solvents.
Master Bond, www.masterbond.com