Circuits Assembly Online Magazine - New Products

New Products

ECM CA-175 snap cure conductive adhesive is designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules. Has a moderate glass transition temperature and modulus. Has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement; is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. Reportedly fully cures in 8 sec. at 200°C.

Engineered Materials Systems, www.emsadhesives.com

SC1 high-performance radial connectors come in single and paired row versions. Are part of the SCM family. Are for high current, high power applications (10A). Come in surface mount and through-hole designs. For battery charging, board-to-board connections, interposers and medical devices.

Everett Charles Technologies, www.ectinfo.com/compliantconnectors

5R7-570(A) RoHS-compliant open board electronic temperature controllers feature a proportional integral control algorithm for precise control of thermoelectric modules (Peltier). H-bridge temperature control is said to provide seamless transition between heating and cooling eliminating dead spots. Green LED for heat and blue LED for cooling indicate mode and simultaneous illumination indicates load circuit is off due to an open sensor. Pulse width modulation controls power level in thermoelectric module at a base frequency of 1Khz. Power resolution is one of ±250 steps in the load circuit control. Is 1.75" x 3.5" X 3" with input voltage of 6 to 28VDC, output voltage of 0 to 36VDC, load current of 0.1 to 12.5A, 450W output power control, control stability of ±0.1°C and temperature range of -20° to 150°C.

Oven Industries, www.ovenindustries.com

FuzionOF platform addresses pre- and post-reflow odd-form assembly. Complements Generation 88HT through-hole portfolio and Polaris Assembly Cell for odd-form automation. Closed-loop processes reduce defects, rework and waste. Reportedly delivers highest available odd-form automation throughput.

Universal Instruments, www.uic.com

Automated drop-jet fluxing head is available on all KISS selective soldering machines. Reportedly provides flux with no overspray. Handles low pH fluxes down to 2.0, as well as fluxes with solids content as high as 35%. Is compatible with alcohol-based fluxes, water-soluble fluxes and rosin-based fluxes. Is fully maintainable. Internal jetting cartridge can be removed for cleaning. Is available with a standard 130 µm orifice diameter; other custom orifices are available. Standard orifice produces an adjustable 2-4mm flux drop size ideal for microscopic deposition for small selective soldering sites without flux residues.

ACE Production Technologies, www.ace-protech.com

T60W-1200-6 baking 60℃ auto dry cabinet is stable at 60℃ and ＜1%RH. Is designed for moisture-sensitive SMD packages to comply with J-STD-033B. Has a temp. and humidity range of 60±2℃; ＜1%RH (auto). Has a capacity of 835L and five stainless shelves. Voltage is 230V, 50/60Hz; display precision is ±3%RH, ±1℃. Is 1mm thick carbon steel with antistatic paint. The door consists of compression handles, airtight magnetic sealers, and antistatic glass. Includes four antistatic 3" wheels, two with brakes. Grounding wire is 1MΩ. Is suitable for ambient temperature >15℃.