New Products
Factory Intelligence Monitoring Module allows users to leverage data available in the TTC platform to calculate and monitor key process indicators over time. Provides an understanding of how machines and assembly lines are running as well as information regarding causes for non-production and material losses.
Cogiscan, www.cogiscan.com
MicroLine 2000 SI laser depaneling system is for rigid and flexible printed circuit boards. Reportedly benefits from a low-stress UV laser beam. Is for removing bare or populated circuits from panels. Reportedly can process any board material, from FR4 to fired ceramics to flexible and rigid-flex substrates.
LPKF, www.lpkfusa.com
Leica DCM8 combined confocal and interferometric optical profiler is for nondestructive 3D surface profiling. Provides high-def confocal microscopy for high lateral resolution and interferometry to reach sub-nm vertical resolution. Provides lateral resolution up to 140nm and vertical resolution of up to 0.1nm. Employs confocal scanning technology without moving parts in the sensor head. Includes four LED light sources: blue (460nm), green (530nm), red (630nm), and white (centered 550nm); has an integrated CCD camera with XY topography-stitching mode.
Leica Microsystems, www.leica-microsystems.com/dcm8
BOMcheck conflict minerals web database provides an integrated tool for uploading EICC GeSI Conflict Minerals Reporting Templates with materials declarations for RoHS, REACH and other regulated substances. Validates data in EICC GeSI Conflict Minerals Reporting Template and provides immediate detailed feedback to correct data validation errors. Can be used to validate compliant smelters.
Environ, www.environcorp.com
CN-1735 underfill is designed to enhance thermal cycle performance of IC packages with pitches as fine as 0.3mm. Reportedly enhances ruggedness for drop and bend test performance. Has a CTE of 40 ppm/°C. Reportedly can be reworked using elevated temperature (170°C to 180°C) to remove underfill fillet.
Zymet, www.zymet.com
Quantum Q-6800 dispensing system for SMT, PCB packaging, and microelectronics assembly has a dispense area of 423 x 458mm. Novel software is said to optimize dispense-head motion to save time and increase units per hour (UPH) for jetted line applications. Optional dual-action or dual-simultaneous valve configurations maximize high-throughput applications and can reduce dispensing time by up to 50%. Dispenses fluid in dots, lines and patterns. Laser height sensor offers real-time, fast, noncontact dispense height measurement. Vision system incorporates high-brightness, three-color RGB LEDs for image contrast and detection. Automatically compensates for changes in fluid viscosity, ensuring volumetric repeatability and optimized line speed for closed-loop fluid dispensing reliability. Flow calibration feature uses weight-controlled dispensing and automatic calibration to continuously deliver consistent fluid amounts, especially for valve and pump dispensing. Supports most Nordson Asymtek jets, pumps and valves.
Nordson Asymtek, www.NordsonAsymtek.com
Press Releases
- ASYS Group Technology Days 2024: A Record-Breaking Celebration of Innovation
- Bittele Electronics Expands High-Complexity, High-Reliability PCB Assembly Services for the AI Industry
- Absolute EMS Appoints Greg Beck as Director of Sales
- Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight December 11-13, 2024