RP-1 solder paste printer has a special mechanism to align the bare PWB with a screen mask; drives three alignment modules attached on the outer circumference of the mask stage to adjust the position in X, Y and θ directions simultaneously. This permits repetitive printing accuracy of circumference fine adjustment to improve up to ±10μm, and duration including correction and movement time reduced to six sec. Optional automatic solder dispenser and cleaning functions available.
Juki, www.jukiamericas.com
MasterSil 705TC silicone-based, single component system sets up in 7 min. and has a noncorrosive cure at room temperature when exposed to atmospheric humidity. Is thermally conductive and electrically insulative. Is said to feature a paste consistency that doesn’t require mixing. For bonding, sealing and coating. Thermal conductivity of 14 BTU·in/(h·ft²·°F) or 2.1 W/m·K. Withstand temperatures from -60° to 400°F. Shelf life of 6 months at room temperature.
Master Bond, masterbond.com/products/one-part-silicone-adhesives-sealants-and-coatings
γ-S330 inline SL/SR PCB separator is fully loading and unloading. A two-way sliding work exchanger limits idle time and simultaneously loads and unloads. Includes 10X CCD camera to minimize programming time and auto-fiducial mark point check and cutting route auto compensation to ensure accuracy.
Aurotek, robot.com.tw
CXP (Convection Expandable Platform) is for surface characterization of PCB local areas under reflow conditions. Is applicable for IPC-9641 concerning warpage measurement of PCB surface mount regions. Software compares warpage results to corresponding component warpage.
Akrometrix, www.akrometrix.com
M8000 Series BER is a highly integrated and scalable bit error ratio tester for physical-layer characterization, validation and compliance testing. Is said to enable fast, accurate receiver characterization of single- and multilane devices operating at data rates up to 16 Gb/s and 32 Gb/s. Streamlines receiver test setup. Offers built-in jitter injection, 8-tap de-emphasis, interference sources, reference clock multiplication, clock recovery and equalization. Automates in situ calibration of signal conditions. Is scalable and expandable. Supports one to four BERT channels and offers data rates of up to 8.5 Gb/s and 16 Gb/s with an extension to 32 Gb/s. Based on AXIe.
Agilent Technologies, www.agilent.com
NanoSlic Gold stencil, for solder paste printing, has a coated stencil underside and aperture walls, making them highly hydrophobic and oleophobic in order to repel solder paste. Coating is thermally cured and permanent, and said to improve solder paste transfer efficiencies for small apertures, resulting in higher yields and less rework. reportedly minimizes bridging and reduces underside cleaning. Is compatible with current assembly equipment and processes.
FCT Assembly, www.fctassembly.com