535-10M-45 UV cured epoxy adhesive is formulated for disk drive, camera module, optoelectronic and circuit assembly applications. Contains a secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Low outgassing. Contain no antimony.

Engineered Material Systems, www.emsadhesives.com

EthermView liquid crystal thermographic analysis system provides optical temperature measurements of active PCBs and components. Uses the color response of thermochromic liquid crystals (TLC) for convenient, non-invasive thermal management studies. Includes solid-state color camera, for macroscopic inspection of boards and components treated with heat-sensitive TLC materials, featuring a flicker-free white light source for clear viewing of dark surfaces and partially concealed elements. Thermal analysis performed by thermSOFT software. Is not affected by ambient temperatures and reportedly is capable of temperature measurements within +/-0.1°C accuracy. ]

Advanced Thermal Solutions, www.qats.com

SN100C P820 D5 is a Pb-free, no-clean solder paste that can suppress flux residue.

Nihon Superior, www.nihonsuperior.co.jp/english

Alconano nano-silver paste makes it possible to join most metals, as well as Si and SiC, at low sintering temperatures, if necessary in nitrogen, without nitrous or sulphurous residues. Achieves strong bonds with high electrical and thermal conductivity at low temperature without external pressure.

Nihon Superior, www.nihonsuperior.co.jp/english