Eexpert 10.6 rework system now comes with the Process Shuttle to streamline flux and solder paste dipping or printing, and pre-positions small surface mountable devices for pickup. Installs on Auto-Vision-Placer (AVP) systems. Features include µSMD Tool, which presents small components with an easy-access fixture, improving processing time. Specific sizes are engineered for optimal pre-alignment. Dipping Tool permits solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste. Different depths are available to yield specific depositions. Printer Tool permits solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing stencils can be easily changed to minimize process setup. Transport slide holds various shuttle tools, which feed diverse components to the rework process in a controlled manner.

Retrofits to existing Martin systems that have automated vision placement. Does not require software programming.

Martin, a Finetech Co., http://www.martin-smt.de

ACE real-time temperature data logger permits placement of up to six thermocouples at critical locations on a board to obtain topside printed circuit board temperature readings. Inputs process information to soldering machine control software. Automatically correlates actual topside PCB readings with the infrared pyrometer that controls the preheat system and can directly control the preheater, if desired. Thermal data from all seven channels – six PCB thermocouples and the preheat control IR pyrometer – can be plotted and imported into a spreadsheet or other database program for further analysis graphical examination. Is compatible with advanced ACE selective soldering machines.

ACE Production Technologies, www.ace-protech.com

SpectorBOX bottom-up modular AOI is for inspection of wave and selective soldered plated through-hole and SMT components. Inspects PCBs inside solder frames directly from the conveyor system. Can be equipped with nine cameras, including an optional Z-axis moveable head. XY drive gantry with ball screw mechanics delivers high-speed inspection. 100% simultaneous inspection can be accomplished with two platform modules combined for bottom and top sides. Accommodates board sizes up to 550 x 520mm.

MEK Europe, www.mek-europe.com

3800-MK2 automated programming system combines universal programming technology, 8th gen., with a fine-pitch handling system. Reportedly is capable of processing programmable devices from the largest QFP to the smallest WLBGA. Includes vision and pneumatic systems that provide VSP support. Provides accuracy and repeatability for packages as small as 1mm x 0.5mm. Can simultaneously support tape, tray, tube and marking.

BPM Microsystems, www.bpmmicro.com