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New Products

Micro Fine soldering iron tips are designed for soldering small components, even on dense boards. Tip sizes range from 0.1 to 1mm. Are available for EB9000S soldering station and EB2000S station; can be used with STTC/SMTC.

EasyBraid Co., www.easybraidco.com

Sigma G5S modular mounter offers a placement speed up to 75,000cph, high-speed head accuracy down to 25µm, and multifunction head accuracy down to 15µm. Can accommodate max. board sizes of 610 x 510mm. Can be equipped with self-loading SL component feeders. Is available in High Speed and Flexible High Speed configurations. Features a two-head placement system; two quick-change feeder bases that accommodate tape and stick feeders or quick-change tray unit with tape feeders, and an Overdrive Control System; both heads can pick from each other’s component supply and place on the same board simultaneously. Max. height for multifunction head is 35mm; insertion force for multifunction head is 100N.

Hitachi High Tech Instruments, www.hht-eu.com

PrinTEK SMT stencil printer now features four CAMs driven directly by a solid steel gear rack. Design is seamlessly integrated within the base of the machine and also features a fluid damper and precision adjustment knob. Is said to improve control over the Z-height adjustment.

Transition Automation, www.transitionautomation.com

 

Excellence Analytical Balances feature indicator lights for full visibility that all balance calibration and routine tests are up to date and to ensure it is safe to start weighing. Static sensor indicates whether electrostatic charge is present by automatically checking samples and containers as they are placed on the balance. Fully compatible with LabX laboratory software.

Mettler Toledo, www.mt.com/green-light

 

XT-3 semiautomated x-ray inspection offers transmission and optional oblique viewing. Is programmable without CAD data. Offers traceable inspection process with an optional barcode reader that also serves to automatically recall and load the inspection program. Designed to address intuitive operation, low-volume production, and failure analysis for SMT production inspection and quality control protocols. Includes image processing software. Tests and measures to IPC specifications, BGA, QFN, FET voiding, as well as barrel fill on connectors.

Matrix-FocalSpot, www.matrix-focalspot.com

Generate Solderpaste Stencil software is available as part of Phototooling Toolbox. Finds components and/or devices on a circuit board, integrates specifications and design rules; makes edits in an automated process. Component library tracks every project, identifying previously encountered components. Edits include automatic home plate, C-shaped and D-shaped pad generation, shifting, shrinking and growing by an amount or percent, heel and toe locking, and independent width and length edits. Edits can be set to round all corners on stencil geometry, set gaps for passive pairs, apply multiple edits with a single click, apply the same edits to standard and associated pads, and apply window-pane belly pad edits. Supported inputs include RS-274X, RS-274D, DXF, DWG, GDSII, ODB++ and DPF.

Infinite Graphics Inc., www.igi.com

 

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