Pilot 4D flying probe testing line includes V8, M4, L4 and H4 testers. Are suitable to test miniaturized circuits with high component density. Have VIVA 3.0 software and new measurement resources deployed on the probes. Provide electrical and thermal test capabilities and onboard digital programming of complex components. Optical inspection performances enable non-invasive tests for capacitor polarity, as well as LED characterization and verification compliant with the automotive industry. Can be equipped with both single and multiple rack loading/downloading modules.

Seica S.p.A., www.seica.com

CA-195 die attach adhesive is for attaching LED and other small semiconductor die to silver and copper lead frames. Is thermally and electrically conductive, and its glass transition temperature (Tg) facilitates wire bonding to small die. Has low extractable ionics and high adhesion to silver and copper lead frames. Has a dispense open time greater than 24 hr.; maintains optimized rheology for pin transfer or needle dispensing.

Engineered Material Systems, www.emsadhesives.com

KY8030-3 solder paste inspection system features KY software. Has a true color display and foreign material inspection. Includes KSMART Warp feature.

Koh Young Technology, www.kohyoung.com

SACM solder alloy reportedly offers 800% improvement in drop-shock test performance without compromising on thermal cycling. Offers a fine grain size with a thin, stable IMC layer, even after exposure to accelerated life conditions. Is doped with manganese and is said to contain less silver than other Pb-free alloys.

Indium Corp., www.indium.com/SACM