Selecta AOI machine serves the selective solder and wave solder processes. Is a “look up” system; imaging is performed on the underside of the printed circuit board assembly. Is capable of inspecting up to 18" x 14" boards. Is configured with a 64-bit operating system and eight cores of processing power. Includes options for automatic database generation from various input sources without 3d party data translators.

Machine Vision Products, www.machinevisionproducts.com

A500X is a faster version of the fully-automated A500 benchtop solder paste inspection machine. Uses structured light scanning technology for 3D reconstruction. Has a laser stripe to compensate for board warpage and for dynamic focusing.

VisionMaster, www.visionmasterinc.com

The 3D function in the AOI XM camera module has a structured light projector and a multistep laser triangulation procedure; projection is picked up by four or eight side-looking cameras. Has an image acquisition rate up to 1.8GP/sec. Also uses existing angular AOI cameras.

Viscom, www.viscom.com

Solderon BP TS 6000 tin-silver plating chemistry is for use in Pb-free solder bump plating applications. Is capable of plating speeds ranging from 2 to 9µm/min. Has an Ag composition. Is reportedly robust for bumping and capping of patterned wafers; is not restricted to specific photoresists. Exhibits with-in die uniformity after reflow of <5%. Is macro- and micro-void free after reflow. Is electrolytically and thermally stable. Offers electrolytic bathlife of >100 Ah/L and a ≥6-mo. pot life; is compatible with inline metrology processes.

Dow Electronic Materials, www.dowelectronicmaterials.com