New Products
SMT production centre can jet solder paste and mount components in one machine. Setup is performed directly from CAD data using an integrated paste library. Is fully automated; solder paste application and component placement are integrated. Solder jet printer performs up to 80,000 dots/hr.; 51µm @3σ; suitable for 0201 components. Range of pastes includes most type 4, 5, 6 or 7 pastes. Solder jet valve can be installed on existing machines. Cleaning of valve takes 5-10 min.
Essemtec, www.essemtec.com
Material Disclosure platform software now comes with Conflict Minerals tracking compliance module. Organizes data for SEC Dodd Frank S 1502 reporting requirements and other global Conflict Mineral rulings. Performs regulatory assessments for REACH, RoHS, WEEE, EPA TSCA, and California Prop 65 and more. Centrally warehouses and manages conflict mineral data across enterprise, along with data for REACH, RoHS, WEEE, etc. Protects bill of material (BoM) supply chain data by keeping details of supplier identity, locations and substance types and quantities confidential from other suppliers. Parses and centralizes critical uploaded data from suppliers. Helps ensure compliance with Dodd Frank, REACH, RoHS, WEEE, US EPA mandates, DfE, TSCA, California reporting and labeling requirements and regulatory requirements in Asia, Africa and South America. Tracks conflict minerals (and origins) and other substances in a supply chain.
Actio, actio.com
Cybersolv C8882 is a fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. Reportedly instantly dissolves all flux types within the solder paste, including water-soluble, rosin and low residue no-clean fluxes. Dries quickly. Available in one, five and 55 gal. containers. Is available in 16 oz. spray bottle containers and pre-saturated wipes.
Kyzen, www.kyzen.com
Aquanox A8830 is an ultra-low VOC, environmentally progressive formulation that reportedly does not damage stencils; is effective at removing solder pastes (water soluble, rosin, and no-clean) from fine-pitch apertures. Is a low odor cleaner than can be used in open systems. Is reportedly ideal for areas where air emissions are regulated. Available in one, five and 55 gal. containers.
Kyzen, www.kyzen.com
0.031" and 0.039" fine pitch wire to board range headers offer small printed circuit board footprints and low-profile mounted heights. Are shrouded and polarized; come in vertical or horizontal orientation. Mating height is 0.155" (in 0.031" pitch). Right angle headers offer a 0.069" mated height, with a footprint depth of 0.154" (in 0.031" pitch). Rated currents are 1.0A for 0.031" pitch and 0.5A for 0.039" pitch, with a temperature range of -13° to 185°F. Come in a selection of colors for polarization purposes.
GradConn, http://www.gradconn.com/Wire-To-Board/
UVCL UV cure coating is a VOC-free, 100% solids coating said to cure in seconds with conveyorized UV lamps, or within 2 hr. at 80C° due to a "multi-cure" mechanism that facilitates cure in shadowed areas. Reportedly has a 12-month shelf life. Is a single-component, low-viscosity coating formulated for "sharp-edge" coverage with common selective coating methods. Shadowed areas will cure in under 3 days at ambient temperatures and humidity, or can be accelerated by a 30-min. bake at 80°C. Meets IPC-CC-830 requirements and is UL94 V-0 rated. UL746E pending. Is said to be resistant to common thermal shock cycling, solvent and fluid exposure, moisture vapor, salt spray and condensing environments.
Electrolube, a division of H.K. Wentworth Ltd., www.electrolube.com
Press Releases
- Robert C. Donovan Joins DISTRON CORPORATION, Marking the Third Generation in Family Leadership
- Incap UK Invests in SMT Technology as Part of Long-Term Operational Development
- Evolve Manufacturing Celebrates 100 Years of Combined Leadership in Medical Device Manufacturing; Noreen King Comments
- STI Celebrates Christy Hill’s 20 Years of Dedicated Service; David Raby Comments