M70 fully automatic SMT placement machine assembly offers flexible Feeding options for bulk components. Optical component centering. Optional fully automatic precision dispenser for solder paste and SMD adhesives. For small to medium volume production. Accepts circuit boards up to 350 x 500mm. Places parts ranging from 0201 to 35 x 35mm and 0.5mm pitch. Has 80 sampling positions for 8mm straps. Placement rate 1,500-1,800 cph. X/Y resolution is 10 microns, and placement accuracy is better than 0.1mm.

Mechatronika, www.mechatronika.com.pl

Moduleclean inline batch cleaning system is for cleaning assembled PCBs, stencils, and other electronics products. Cleans surface mount technology applications such as defluxing of low-residue and Pb-free technology. Options include ultrasonic, spray-in-air, spray-under-immersion, oscillation-under-immersion, and air-under-immersion. Can be designed as a modular system built in various configurations. Features include 100% filtration; rinsing with DI water reclaim; vacuum dryer, and process traceability.

PBT Co., www.pbt.cz

X-Quik x-ray inspects items such as electromechanical devices, sensors, molded parts, mail parcels and biological samples. Footprint is just more than 2 ft.³. Is suited for engineering labs, machine shops and quality control departments. Provides “click to scan” operation. Reportedly no training required. Image formats may be exported via wireless communication to desktop PCs, tablets or mobile phones. Available image analysis tools include data archival, image annotation, automatic contrast optimization and digital zoom. Image output formats include BMP, JPG and DICOM. Has an 80 kV mono-block source and LDA detector.

VJ Electronix, www.vjelectronix.com 

SFX Gang Test Module Kit consists of three basic modules for easy-to-integrate, parallel test or programming of up to 16 or 32 units. Requires one system controller. Can be flexibly adjusted to various environments and different test and programming applications such as flash programming, MCU programming or dynamic tests per Processor Emulation. Consists of three interconnected module types – a TAP transceiver, a multipurpose parallel I/O unit, and a power management unit. For simple system integration, all modules have onboard Mass Interconnect Interfaces from Virginia Panel, and are controlled by a central controller. Supports all modern technologies for Embedded System Access (ESA). In addition to boundary scan, these are Processor Emulation and chip-embedded instruments, for design validation, hardware debugging, production test, programming without probe or nail utilization (non-intrusive). Each site can be individually programmed in several parameters (protocols, voltage, delays etc.).

Goepel, www.goepel.com