New Products
XT-6 x-ray inspection machine features hexapod-manipulator for detailed, extreme x-ray transmission angles. Inspects electronic components, double-sided PCBs, complete modules, casting parts and medical implants. Can be equipped with an automatic load/unload or for CT configuration. Permits free and flexible movements on all axes based on a parallel-kinematic hexapod manipulation unit. Six axes motion unit move flexibly with one hand via space mouse navigator in vertical and horizontal direction and around 180°. Standard system setup is suitable for inspection dimensions up to 400 x 400mm; XL configuration for up to 550 x 550mm is optional. Can be equipped with different x-ray tubes up to 160kV and detectors. Provides up to 4 x-ray images per second in transmission mode. For laboratory inspection and automatic small series production. Comes with a Planar CT reconstruction setup and CT visualization software. Automatic load/unload with an in/out shutter system.
MatriX Technologies, www.m-xt.com
Selecta AOI machine serves the selective solder and wave solder processes. Is a “look up” system; imaging is performed on the underside of the printed circuit board assembly. Is capable of inspecting up to 18" x 14" boards. Is configured with a 64-bit operating system and eight cores of processing power. Includes options for automatic database generation from various input sources without 3d party data translators.
Machine Vision Products, www.machinevisionproducts.com
A500X is a faster version of the fully-automated A500 benchtop solder paste inspection machine. Uses structured light scanning technology for 3D reconstruction. Has a laser stripe to compensate for board warpage and for dynamic focusing.
VisionMaster, www.visionmasterinc.com
The 3D function in the AOI XM camera module has a structured light projector and a multistep laser triangulation procedure; projection is picked up by four or eight side-looking cameras. Has an image acquisition rate up to 1.8GP/sec. Also uses existing angular AOI cameras.
Viscom, www.viscom.com
Solderon BP TS 6000 tin-silver plating chemistry is for use in Pb-free solder bump plating applications. Is capable of plating speeds ranging from 2 to 9µm/min. Has an Ag composition. Is reportedly robust for bumping and capping of patterned wafers; is not restricted to specific photoresists. Exhibits with-in die uniformity after reflow of <5%. Is macro- and micro-void free after reflow. Is electrolytically and thermally stable. Offers electrolytic bathlife of >100 Ah/L and a ≥6-mo. pot life; is compatible with inline metrology processes.
Dow Electronic Materials, www.dowelectronicmaterials.com
LV1000 low-voiding flux coating is for solder preforms. Is halide-free and is reportedly suited for assembly processes in which components don’t allow for proper outgassing of volatized flux. Provides a clear coating; doesn’t clog pick-and-place equipment. Has weight percentage as low as 0.5%. Is applied to the outside of the preform where flux is required.
Indium Corp., www.indium.com
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