SPI-Pilot 1.4 integrated system software includes 3D calculation. Includes enhanced algorithm for measured value determination; OptiCon SPI-Line 3D System provides measurement data for volume, offset and height of solder deposit. Offers extended module for statistical process control and real-time monitoring of printing process. Fault and work statistics are displayed as charts and tables. Can be controlled via tablet PC.

Goepel electronic, www.goepel.com  

Ersa CAD Assistant 3D solder program editor provides offline machine program generation. Is built according to specific equipment configurations. Clearly displays data set for CNC axis systems in a table. Plausibility check prevents errors from occurring during program creation. Both CAD files of PCBs (.dxf and .step) and image files (.jpg and .bmp) can be used as basis in the program generation. All movements of the fluxer axis and solder bath axis are graphically entered on the image of the board, after which process data are added. Program files can be verified with 3D visualization and used immediately in the selective soldering machine. Modifications entered with the program editor RSAOSFT also are graphically visible with CAD Assistant 3D.

Ersa, www.ersa.com

XT-Armor Oven Shield mask coating protects oven surfaces between scheduled maintenance. Is painted onto cooling zone surfaces, flux sticks to the coating, and then is peeled off – drastically reducing maintenance time. Is said to reduce maintenance labor by 50% and equipment downtime by 25%. Has been successfully tested on BTU, Heller, JTU, SMT, Speedline and Vitronics-Soltec ovens and wave machines. Works in closed-loop nitrogen ovens. It is intended for the cooling zones, where residue condensation is worst. Can be applied to an oven’s cooling chamber inner walls and surrounding areas, flux management system chamber walls, flux collection plate, inlet and outlet fan isolator plates. For wave soldering systems, can be applied to the areas surrounding the spray fluxer unit. Coating can be cured at ambient temperatures or accelerated with the oven’s heat cycle. Lasts four to six weeks. Is low odor, non-hazardous, nonflammable and water washable. Has no VOCs, GWP or halides.

Techspray, www.techspray.com

CA-165 conductive adhesive is for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules. Has a moderate glass transition temperature (Tg) and modulus. Has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces.

Engineered Material Systems, www.emsadhesives.com