GF-125 HC/HT five-zone horizontal convection reflow soldering oven has longer conveyor length and two additional zones. Has tunnel length of 56". GF series incorporates Horizontal Convection Heating technology; air is circulated horizontally in one direction above the board and in the opposite direction below the board. Compatible with Pb-free solder.
DDM Novastar, www.ddmnovastar.com
PSV7000 automatically programs up to 2000 devices/hour with tray, tape or tube input. Is capable of handling devices as small as 1.5 x 1.5mm. Cuts changeover times up to 75%. Options include laser marking, 3D co-planarity, serialization and traceability software. Can have up to 96 individual programming sockets installed and supports all device types, including FPGAs, CPLDs, microcontrollers, and flash memories (including eMMC, NAND and NOR devices).
Data I/O, www.dataio.com/PSV7000
Zestron Eye monitors wash bath concentration in the presence of flux loading. Consists of sensor and digital controller that displays concentration in real time. Fully integrates with commonly used cleaning machine types by leading manufacturers. For use with Zestron cleaning agents.
Zestron, www.zestron.com
Tags: Zestron, PCB cleaning, flux, wash bath monitor
Direct Board Interconnect Technology (DBiT) process for terminating lead wires or flexible circuits directly on to a PCB eliminates connectors, while producing a high quality connection. Performs direct connection of wire, component lead, or flex circuit via a crimping system. Requires no soldering. Continuous-feed splicing material process.
Autosplice, autosplice.com
Model S1 mkII solder paste inspection system performs high-speed 5D inspection (simultaneous 2D and 3D inspection). Re-engineered inspection head has improved 2D image capture. Patented sensor technology simultaneously combines 2D and 3D image processing, reducing inspection tolerances. True area, shape, volume, offset and height measurements provided in combination, for process control.
MEK Europe, www.mek-europe.com
TAGS: MEK, solder paste inspection, AOI, printing, SPI, SMT
CA-102 conductive adhesive, for bonding components to circuit boards, has a moderate glass transition temperature (Tg) and modulus. Rheology is optimized for screen printing and can be needle-dispensed by time-pressure, auger or positive displacement. Provides conductivity stability during damp heat testing on tin, silver and copper surfaces. For requiring lower-stress, lower-temperature processing or Pb-free applications
Engineered Material Systems, www.emsadhesives.com
TAGS: conductive adhesive, Engineered Material Systems, SMT, electronics assembly, printed circuit board