FH35C Series 0.3mm pitch (FPC) flexible printed circuit connector supports high-speed transmissions and provides high retention forces. Back flip style actuator utilizes dual-sided FPC and helps to achieve impedance characteristics. Mounted depth 3.2 mm. Bottom-side features fully-enclosed molded structure for added protection to the contacts. Contacts have additional nickel barrier to prevent solder wicking. Clearance between contacts and housing designed to prevent capillary migration of flux from SMT leads to contact points. Features rugged actuator that confirms when locking function has been completed. Mounted profile of 0.9mm. Come in 9 to 51 positions (9, 11, 13, 15, 17, 19, 21, 23, 25, 27, 31, 33, 35, 37, 39, 41, 45, 49, 51), with an operating temperature range from –55° to +85°C. Complies with halogen-free requirements and is RoHS compliant.

Hirose Electric, www.hirose.com/us

TAGS: flexible printed circuit connector, Hirose, high-speed

Have you registered for PCB West, the Silicon Valley's largest printed circuit board trade show? Sept. 24-26, at the Santa Clara Convention Center. www.pcbwest.com

MicroLine 2000 laser system, for separation of bare and assembled rigid and flexible PCB materials, come with different laser powers. Feature faster fiducial registration and optimized dynamics. Software facilitates production setup. MicroLine 2820 SI is inline-capable and can be integrated directly into SMEMA-compliant production lines.

LPKF, www.lpkf.com

TAGS: LPKF, separation, scoring PCB, printed circuit board

Have you registered for PCB West, the Silicon Valley's largest printed circuit board trade show? Sept. 24-26, at the Santa Clara Convention Center. www.pcbwest.com

KISS-102 selective soldering machine now comes with a board size and soldering area of 16” x 16” (406 x 406mm) with no increase in machine footprint.  Handles a range of flux types with either an atomizing flux applicator for speed or precision drop-jet applicator for no-clean processing. Optional “Super Quick” z-axis motion and closed-loop positioning feedback with linear encoders, dual solder nozzle pump assembly, and dual LCD monitors.

ACE Production Technologies, www.ace-protech.com

Fineplacer pico ma is for bonding anisotropic conductive film (ACF). Achieves applied bonding forces of up to 700 N, for coherent, durable bonds between the chip and ACF. Features a new multi-chip transfer station, which permits up to four components to be placed simultaneously and bonded with defined distances. Precision z-hub positioning table achieves 5-micron placement accuracy. Places component sizes from 0.125 x 0.125mm to 40 x 40mm and the shifting optics enable alignment of long chip edges. Supports wafer or substrate sizes up to 8". Suited for high-mix, low-volume applications.

FineTech, www.finetechusa.com

TAGS: FineTech, ACF, anisotropic conductive film, component bonding