Benchmark 4.0 software is for the Momentum series, Accela and MPM125 printer platforms. Is supported by a more powerful computer and a wide-screen monitor; is a Windows 7 OS system that incorporates an open software architecture: OpenApps. OpenApps provides two-way communication between the printer and, for example, the user’s own in-house manufacturing execution system. Can develop the system on one’s own, use a 3rd party developer, or Speedline can provide resources to assist in development.

Speedline Technologies, www.speedlinetech.com

PCB Library Expert version 2013 software takes component data and automatically creates footprints and 3D models based on predefined settings. Now includes a Footprint Designer module, allowing users to create footprints for non-standard components with asymmetrical, arbitrary-style leads. Reportedly enables users to create footprints for 9 of 10 components used in a typical project. IPC now distributes the tool, along with library documentation consisting of 5,000 components. Outputs to formats readable by Allegro, OrCAD PCB, OrCAD Layout, CADint, Altium, DesignSpark, Expedition, PADS Layout, Cadstar, CR-5000, Pantheon, Pulsonix, P-CAD, Ultiboard, Target 3001!, Eagle, DipTrace and Board Station, with 3D STEP and SoloPCB in development. Library Expert Lite is free and outputs to the CAD formats mentioned above.

PCB Libraries, www.PCBLibraries.com

MB600S aqueous-based sodium silicate coating is said to provide electromagnetic interference/radio frequency interference (EMI/RFI) shielding. Is effective as aluminum reference with a range of 95-105 dB, from 100 MHz to 2 GHz, per IEEE 299, 2006 methods. Above 2 GHz, shielding effectiveness decreases to 80 dB and slightly below. Above 4 GHz, effectiveness is 60-70 dB. Is relatively non-toxic and easy to handle. Can be brushed or sprayed on. Cures at room temperature in 24 to 48 hr. or in 1 to 2 hr. at 80°C. Service temperature range 0° to 700°F.

Master Bond, masterbond.com/tds/mb600s

Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board assembly reportedly prints well, particularly with ultra fine feature repeatability (11 mil squares) and high-throughput applications. Lumet P34 is for long soak reflow profiles. Lumet P39 Pb-free, zero-halogen, no-clean solder paste is for LED assembly and other applications that must pass JIS Copper Corrosion test. Lumet P39 has clear, colorless flux residue; is for LED package-on-board assembly. Is designed to enable consistent fine-pitch printing capability to 180µm circle printed with 100µm thickness stencil. Lumet P52 Pb-free alloy has a melting point below 140°C, and has been used with peak reflow profiles between 155° and 190°C.

Alpha, http://alpha.alent.com/Markets/LED