Buzzard camera and illumination system for optical inspection of selective solder joints to be integrated into external test cells. Contains 4Mp camera with GigE interface, multispectral illumination, PC and software. Can be configured to optical test demands of each inspection system. Camera provides functionalities for image pre-processing. Multispectral illumination includes control, coverage of light spectrum from UV to IR, and high-contrast images of inspected solder joints and components. Includes TOM Line software for industrial applications; features a range of test functions, for example to evaluate plated through-hole solder joints, shorts or solder splashes. Software can be operated by a remote interface.

Goepel electronic, www.goepel.com

XT-657 flame retardant bonding tape helps prevent the propagation of fire, provides dielectric separation between electrical circuits, and eliminates mechanical fasteners in battery assemblies and packs. Halogen-free UL94 VTM-0 tested tape provides a thin conformal bond line and offers an adhesive strength of greater than 32 oz/in (>35N/100 mm). Is used to attach batteries and components to chassis, boards, other batteries, etc. Is REACH and RoHS compliant; includes a 25µm polyimide film, two layers of 1 mil acrylic pressure sensitive adhesive and liners that aid in handling, die cutting and auto application. Has dielectric strength of >7.6 kV/mil (>299kV/mm).

Polyonics, www.polyonics.com

MR252/MR252-M model is part of the Micro Prober family of high-speed open and short circuit testers for flexible and rigid circuit boards. Reportedly reduces test takt time; cuts footprint by about 30%. Sets upper limit to the size of target circuit boards. MR252-M can do two processes in parallel – continuity/insulation tests and marking of test results on the target boards – by putting on a separate stage a mechanism that marks test results on the circuit board. High-speed test capable of 500,000 to one million contacts per month. High-precision positioning with an accuracy of 5 µm plus or minus. Recognizes images captured with a CCD camera built in each testing head mounted on a moving arm; corrects positioning of the testing jig on X, Y and theta (tilt) axes. Test circuit unit is capable of four-terminal sensing.

Yamaha Fine Technologies Co, http://www.yamaha.co.jp/finetech/english/

Continuous Path Motion Control software for jetting underfill for flip chips optimizes dispense head motion, saving time and increasing units per hour. Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the head maintains a continuous speed and direction throughout the process. Improves overall cycle time by 27% under certain conditions.

Nordson Asymtek, www.nordsonasymtek.com