MPM EnclosedFlow print head now features positive-displacement, motor-driven pressure system that controls paste chamber pressures to within +/- 0.1 psi. Prints fine features such as 01005s and 0.3mm pitch CSPs with reportedly up to 50% greater volume and 25% lower deviation than squeegee blades. Is good for high-volume fills such as paste-in-hole. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke. Is a "plug-and-print" solution. Is for high product mix environments; has detachable, modular chambers that can be removed and stored with fewer than 5 min. needed for changeover. Comes on Accela and new printers; supported sizes include 8", 10", 12", 14", 16", and 18".

Speedline Technologies, www.speedlinetech.com

Capital Harness TVM software automatically generates electrical system and wire harness manufacturing process and cost data specific to each harness design, factory and company’s cost models. Supports process choice and sourcing decisions. Is able to act directly on design data generated by other tools from the Capital suite, and can be implemented as part of an extended flow or standalone. Reads data in several standard formats, including KBL. Data can be received from a variety of industry tools.

Mentor Graphics, www.mentor.com
 

topoView is part of XI-Pilot v. 3.1 x-ray inspection software for evaluation of x-ray images. Facilitates interpretation of x-ray images with respect to better fault assessment and classification. Construes every grey value of an x-ray image as a change in material thickness and density. Thick materials such as solder (dark grey values) are displayed on a higher position than less thick PCB materials (light grey values). Faults such as lifted leads, shorts, non-soldering, insufficient or too much solder are displayed.

Goepel electronic, www.goepel.com 

Asscon VP1000 and VP6000 vapor phase reflow systems now come with Dynamic Profiling, which automatically adjusts and controls reflow profiles. Simplifies setup and preparation of reflow profiles; eliminates interferences due to different loads or usage conditions. User determines temperature profile and keys in values to the PLC user interface. Can create soldering program by determining start soak temperature (°C), duration ramp, and time above liquidus. Uses embedded three temp. reference measuring points for permanent control and monitoring of the profile. Controller can use temp. behavior of selected reference measuring points to start appropriate control actions during profiling.

Asscon Systemtechnik, www.asscon.de