New Products
CA-195 die attach adhesive is for attaching LED and other small semiconductor die to silver and copper lead frames. Is thermally and electrically conductive, and its glass transition temperature (Tg) facilitates wire bonding to small die. Has low extractable ionics and high adhesion to silver and copper lead frames. Has a dispense open time greater than 24 hr.; maintains optimized rheology for pin transfer or needle dispensing.
Engineered Material Systems, www.emsadhesives.com
KY8030-3 solder paste inspection system features KY software. Has a true color display and foreign material inspection. Includes KSMART Warp feature.
Koh Young Technology, www.kohyoung.com
SACM solder alloy reportedly offers 800% improvement in drop-shock test performance without compromising on thermal cycling. Offers a fine grain size with a thin, stable IMC layer, even after exposure to accelerated life conditions. Is doped with manganese and is said to contain less silver than other Pb-free alloys.
Indium Corp., www.indium.com/SACM
EB2000S lightweight, compact soldering station operates at 470 KHz. Is based on Curie heat technology; responds to thermal demands of each solder joint by regulating power instantaneously. Allows use of three different handpieces and EK, EP, and ES series tips. No calibration is needed.
EasyBraid Co., www.easybraidco.com
Pico xMod dispensing valve uses piezoelectric actuation technology for continuous operation at speeds up to 500 cycles/sec. Can produce deposits as small as 2nL. Reportedly non-contact jet valve makes it possible to apply fluid in hard-to-access areas or onto uneven or delicate substrates for applications in electronics, automotive, life sciences, solar, and other industrial dispensing applications. The Piezo Actuator, the Valve Seat, the Fluid Body, the Cartridge ball/stem assembly, and Heater Set are interchangeable and assembled for each application; can be disassembled for cleaning, repair, or maintenance.
Nordson EFD, www.nordsonefd.com
Sarcon GR45A-00 is a low modulus thermal interface material with a low thermal resistance. Fills air gaps between components, board protrusions and recessed areas. Reportedly exhibits very low pressure. Provides thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W. Is available in pre-cut sheets up to a max. size of 200mm x 300mm. Can be die cut to application specifications. Material thicknesses from 0.5mm to 5.0mm can be specified in 0.5mm increments.
Fujipoly America Corp., www.fujipoly.com
Press Releases
- ASYS Group Technology Days 2024: A Record-Breaking Celebration of Innovation
- Bittele Electronics Expands High-Complexity, High-Reliability PCB Assembly Services for the AI Industry
- Absolute EMS Appoints Greg Beck as Director of Sales
- Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight December 11-13, 2024