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Integrator Software v. 5.4 is for the Flying Probe FLS series. Features a power-up box design and better integration of different power sources. Precision Relay Test Template and Relay Timing Template reportedly provide more complete functional testing of relays. Templates verify the relays’ functional performance in two areas: delayed contact closure and closed contact resistance. The no-fly zone operation can be used during initial fiducial setup and execution of board find. Shuttles do not move back to home positions when orbiting around no fly zones; they move to ready positions just outside the board area. Has a probe tip model that helps prevent damaging probe tips against parts and eliminates crossed tips at landing positions. PBA2 Import now can generate tests and populate four types of voltage templates using VOLT class in XMatic.

Acculogic, www.acculogic.com

 

DFC3000 G grayscale USB 3.0 microscope camera for routine fluorescence applications features a passive cooling architecture and correlated pixel double sampling. Provides clear fluorescence signals and low background noise. CCD sensor makes it suitable for low light situations such as fluorescence. Provides live images of up to 30 frames per sec.

DMC2900 USB 3.0 microscope camera has a 3.1 MP CMOS sensor for standard brightfield applications. Equipped with sensor that produces live images of up to 30 frames per sec. Color engine processes images real time with stable live image speed. USB 3.0 interface

Leica Microsystems, leica-microsystems.com/science-lab/topics/fluorescence-microscopy/

Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use of local and global inspection libraries. Can be used in parallel with library toolbox.

Integrates SPI Closed Loop (Downlink) so that currently measured displacement values of the SPI inspection can be returned to the paste printer as offset correction values.

Enables detailed appraisal of recognized defects in parallel with defect verification on S2088-II AOI, with live capture of defect image viewable under different camera perspectives — orthogonal and angled — and in color.

 

Viscom, viscom.de

 

EP30HV two-component epoxy is for bonding, sealing, coating and casting applications. Offers light transmittance from 350-2,400nm and has a refractive index of 1.55 at room temperature. Volume resistivity is over 1015 ohm-cm, dielectric strength is 440 V/mil and has a low coefficient of thermal expansion. Mixed viscosity 4,000 cps.  Cures at room temperature in 24 hr. or faster at elevated temperatures. Tensile strength exceeds 9,000 psi. Compressive strength greater than 14,000 psi at ambient temperatures. Linear shrinkage is 0.0003"/inch. Resists water, oils, acids, bases and many solvents. Serviceable over -60° to +300°F temperature range.

Master Bond, masterbond.com/properties/electrically-insulative-adhesive-systems

TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of possible standard camera configurations extends from one to multiple camera configurations (1 to 5Mp) as color or black/white variant. Various illuminations for the visible and UV ranges (conformal coating) are available. Also can be used for component presence, selective solder joint inspection, display and LED check, color recognition and optical character reading. Intuitive software enables a simple, convenient test program generation without programming knowledge. Custom camera, illumination and software integration optional.

GÖPEL electronic, www.goepel.com

 

Many Separo solder recovery system quickly and easily reclaims solder. Reportedly turns a shift's worth of wave solder dross to usable solder ingots in under an hour.  Works with lead-free or SnPb alloys and is capable of treating 4 to 5 kg (9 to 11 lb.) of hot or room-temperature dross per cycle. Heavier solder alloy settles at the bottom of a heated crucible while lighter dross oxides rise to top and are captured in a custom filter. After 30 to 40 min. molten solder is transferred to the five ingot molds below the crucible. No chemical additives required. Reclaimed alloy is 100% pure and usable.

MGR Electro, mgrelectro.com/en/prodotti/separo-2

Manncorp, manncorp.com/solder-recovery

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