OM/C thermal stress system cycles to temperatures as cold as ?75C, in line with requirements for aerospace, defense and automotive applications. 
Achieves negative cycling temperatures through use of liquid nitrogen (LN2) as the coolant. Single setup assembly reflow simulation and thermal cycling with one setup. Convection assembly reflow simulation based on IPC-TM-650, Method 2.6.27 (230C and 260C profiles). Built on existing air-to-air thermal shock methodology (reference IPC-TM-650, Method 2.6.7.2B). Single chamber air-to-air thermal shock cycling from -75C to +230C. Continuous resistance temperature detector (RTD) monitoring, feedback and control. Simultaneously tests 12 HATS, 24 IPC-2221B D-type, 12 IST, or multiple custom designed coupon configurations. Automatic data analysis and report generation.

Conductor Analysis Technologies, www.cat-test.info

KISS-101IL inline selective soldering system includes an automated two-point fiducial alignment and skew correction system, high-speed Z-axis, heated nitrogen system, a witness camera and automated spray fluxer.  Options include a drop-jet fluxing system, additional witness camera, dual LED monitors, topside preheating, an inline fluxing and preheating module, offline programming and a 75mm wide wave nozzle. Is SMEMA-compatible. Equipped with Super Quick processing speeds. When equipped with a drop-jet flux applicator, it can handle a range of flux chemistries, including low pH fluxes down to 2.0 and fluxes with solids content as high as 35%. Has SWAK-OS machine operating software.

ACE Production Technologies, www.ace-protech.com

SMT 158 series of underfill is customizable in color, filler concentration, and particle sizes. Is said to cure fast and at low temperatures. For bare chip protection in advanced packages like memory cards, chip carriers, hybrid circuits and multichip modules. Is said to eliminate cleaning. Is compatible with lead-free processes and for ultra-low bump applications such as chip-scale packages, ball grid arrays, PoP, land grid arrays, and some flip-chip applications. 

Yincae Advanced Materials,  http://www.yincae.com/technical-information.html 

i-CON Pico and i-CON Nano soldering stations have a footprint of 145mm x 80mm. i-CON Pico is intended for hobbyists; i-CON Nano reportedly meets all criteria for ESD protection and is intended for industrial use. Both stations can be configured using a microSD card. 80W soldering stations use ultra-light i-Tool soldering iron; available with a range of soldering tips. i-CON 1 and i-CON 2 are professional industrial soldering stations powering  150W i-Tool. Both stations are operated using a text display and i-Op control knob. Other soldering and de-soldering tools can be connected to i-CON 2. Are available with optional interface for an IR preheating plate or a solder fume extraction unit. i CON Vario 2 and i-CON Vario 4 are multichannel soldering and de-soldering stations equipped with i-Tool Air S, a 200W hot air soldering iron. One additional tool is connectable to Vario 2; three soldering and de-soldering tools can be operated in addition on Vario 4, which is reportedly ideal for soldering tasks in development, production, rework and maintenance. Both stations are equipped with standard control interfaces to an IR preheating station and a solder fume extraction unit.

Kurtz Ersa North America, www.ersa.com