X3L 3D inline x-ray inspection system comes with dual detector, combining a line-scan for transmission inspection of PCBs in a few sec. and a high-res digital flatpanel detector for selective 3D image capturing. Offers transmission, off-axis image capturing, and 3D-SART. Uses a readout TDI camera (line scanner) in parallel, reducing image capturing for 18x16" PCBs to fewer than 10 sec. 3D-SART (simultaneous algebraic reconstruction technique) provides slice images for solder joint analysis. Uses MIPS platform with links to MIPS software modules for programming, classifying and verification. MIPS verify now supports defect image verification with an extended 3D functionality.

MatriX Technologies, www.m-xt.com

LTS 300 is an automated hot dip solder lead tinning system for reconditioning plated through-hole, SMT and QFP components. Reportedly ensures compliance with RoHs and reliability requirements. Combines three tinning processes in one machine; performs a dip process for through-hole components, a drag process for chips and LCCs, and is equipped with a vacuum-articulated spindle for tinning QFP leads. Applications include refurbishing legacy components; gold embrittlement mitigation; tin whisker mitigation; converting RoHS components to Sn/Pb and vice versa; solderability testing, and BGA cleansing. Employs a dip process for T/H components, using a flat wave solder nozzle, working in conjunction with pallets that hold the components in position. A pallet of components moves to the flux station, followed by preheating, then to the first solder pot to remove coating. A side-to-side motion provides a scrubbing action to help dissolve plating into the scavenging alloy. Pallet returns to flux station, where leads are fluxed and conveyed to second solder pot for intermetallic coating.

ACE Production Technologies Inc., www.ace-protech.com
 

UV25 one-component UV curable material is for bonding, sealing, coating and encapsulation applications. Has a glass transition temp. of 186°C. Is serviceable between -60° and +500°F. Is optically clear with a refractive index of 1.55 at room temp. On exposure to a UV light source emitting at a wavelength of 320-365nm with an energy output of 20 to 40mW per cm², it cures in 20 to 30 sec. Contains no solvents or volatiles; features low shrinkage upon curing. Bonds well to glass, surface treated metals and plastics such as polycarbonates and acrylics. When used in potting applications, it can cure in section up to 0.100-0.120". At room temperature, it has a viscosity of 7,000-11,000cps.

Master Bond, www.masterbond.com

90iSC lead-free solder alloy is said to process much like a traditional SAC alloy but with superior temperature cycling performance, consistent with or better than conventional SnPb solders. Is a multi-component alloy based on traditional SAC but with improved temperature resistance and reliability characteristics. Has a temperature cycling range from -40° to 155°C, optimized creep resistance at high temperature, vibration and drop test performance comparable to SAC and other lead-free alloys and has printing and reflow behavior consistent with alternative lead-free materials. Is compatible with several Henkel lead-free and halogen-free flux systems.

Henkel, www.henkel.com/electronics