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Capital Harness TVM software automatically generates electrical system and wire harness manufacturing process and cost data specific to each harness design, factory and company’s cost models. Supports process choice and sourcing decisions. Is able to act directly on design data generated by other tools from the Capital suite, and can be implemented as part of an extended flow or standalone. Reads data in several standard formats, including KBL. Data can be received from a variety of industry tools.

Mentor Graphics, www.mentor.com
 

topoView is part of XI-Pilot v. 3.1 x-ray inspection software for evaluation of x-ray images. Facilitates interpretation of x-ray images with respect to better fault assessment and classification. Construes every grey value of an x-ray image as a change in material thickness and density. Thick materials such as solder (dark grey values) are displayed on a higher position than less thick PCB materials (light grey values). Faults such as lifted leads, shorts, non-soldering, insufficient or too much solder are displayed.

Goepel electronic, www.goepel.com 

Asscon VP1000 and VP6000 vapor phase reflow systems now come with Dynamic Profiling, which automatically adjusts and controls reflow profiles. Simplifies setup and preparation of reflow profiles; eliminates interferences due to different loads or usage conditions. User determines temperature profile and keys in values to the PLC user interface. Can create soldering program by determining start soak temperature (°C), duration ramp, and time above liquidus. Uses embedded three temp. reference measuring points for permanent control and monitoring of the profile. Controller can use temp. behavior of selected reference measuring points to start appropriate control actions during profiling.

Asscon Systemtechnik, www.asscon.de 

 

X Series placement machines are up to 0.5 meters shorter than the previous models. X4i S places 120,000 components per hour (cph) in a footprint of 1.9 x 2.6 m. Come in three- (X3 S, shown below) and four-gantry (X4i S) models, with slots for up to 160 8mm feeders, conveyors for boards up to 650mm wide, barcode readers, adjustable pin support, interchangeable gantries and new tray feeders. Handle printed circuit boards up to 610 x 560mm. Dual-conveyor setup handles PCBs up to 450 x 300mm. Places components from 01005 to 200mm long.

Siplace, www.siplace.com

 

Unscrambler X 10.3 multivariate data analysis and design of experiments software now offers better plotting tools, sample selection techniques, a new spectroscopic transformation, an improved DoE module and better handling of process data. Includes exploratory data analysis, regression and classification methods, predictive modeling, and descriptive statistics. Units and ranges can be defined and saved with PLSR, PCR, MLR and PCA models for assigning multiple input parameters; can set alarm and warning limits for PLSR, PCR, MLR and PCA models; has an optional plug-in enabling direct import from OPC DA servers and OSISoft PI databases. Includes interactive response surface plots in the DoE module. D-optimal designs in the DoE module have been enhanced. Has 2D-scatter plots automatically grouped by first category variable in data tables, sample labeling by data value, and new outlier plots with F-residuals. Sample selection tools now include the Kennard-Stone method. A spectroscopic attenuated total reflectance transformation has been added to correct for wavelength-dependent light penetration effects in IR spectroscopy.

CAMO, www.camo.com

Indium6.4 solder paste is water-soluble and said to minimize voiding under QFN and BGA assemblies. Reportedly yields less than five% voiding. Comes as standard type 3 powder in Sn63, Sn62, and Indalloy100 (tin, lead and silver).

Indium, www.indium.com

 

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