Wafer-Vac general-purpose wafer vacuum handling tool comes with 8" molded wafer tip (WV-9000-MW8). Handles wafers, solar cells and other substrates. Diaphragm vacuum pump generates up to 10" of mercury with an open air flow of 2.3 lpm. Connects to ground automatically with a three-wire power cord. Class 100 Cleanroom safe. Comes standard with long-life pump and push-button wafer tip pen: VWP-500-2.5mm. Has a footprint of 7¼" x 3" x 2½" and comes with 6' of clear coiled vacuum hose. Plugs directly into 110V 50/60 Hz.

Virtual Industries, www.virtual-ii.com
 

Rapido RPS3000-S32XL provides an increased surface for multi-board panels up to 500 x 500 mm. Is based on Scanflex with short wire interface for up to 32 sites; supports double-sided probing for up to 3,000 nails. Developed for in-system programming of non-volatile memories such as Flash, MCU and PLD. Allows a combination of programming tasks with test strategies such as boundary scan, processor emulation, chip embedded instruments or functional test; can be executed in parallel on 32 boards integrated into one panel.

Goepel electronic, www.goepelusa.com

NC722 low-melting SnBi solder paste is halide-free and rosin-based. For use with low-temperature alloys such as Sn42Bi58. Reportedly offers good open times, abandon time and soldering activity with all surface finishes. Meets or exceeds ANSI/J-STD -004, -005 requirements, as well as Bellcore test criteria. Features print volume consistency with surface area ratios as low as 0.55. Is suitable for high RH areas.

FCT Assembly, www.fctassembly.com

PowerSpector series includes four desktop and three inline AOI machines. FDAz inspection head is designed for post-reflow applications with objects invisible to systems with top-viewing cameras, such as J leaded components and QFNs; inspects SMT and THT component bodies for presence/absence, type, polarity, offset, text, colors, etc., and components solder fillets for excessive, insufficient, no solder, shorts, lifted leads, etc. Suitable for use in pre-reflow, post-reflow, post-wave and post-selective; can be used for 2D solder paste inspection and first article inspection. High-res top camera has telecentric lens and multiplexed 8x CameraLink side camera technology with Tilt-Shift lenses in 45/45° configuration; can choose between 10µ and 18.75µ per pixel lenses. Three light sources with different colors and from different angles create a profile of solder menisci, while the main light results in real color representation of components. Diffused On Axis Light (DOAL) projects 90⁰ on the target components. Motorized, vertical height-adjustable optical head compensates for PCB warpage and reportedly adapts to any PCB thickness.

MEK, www.mek-europe.com