Spectroscout portable energy dispersive x-ray fluorescence (ED-XRF) analyzer enables elemental analysis of environmental and geological samples, even in remote locations. Weighs 12 kg; is carried with a shoulder strap. Is encased in rugged housing. Is 270 x 306 x 306mm. Features include a sample compartment, x-ray tube, onboard processor, and battery pack. An optional integrated video system allows precise spot testing, plus image storage. Has 10 to 15 min. turnaround. Includes touchscreen interface and pre-installed software. Has iCAL calibration; takes one sample and 5 min. for standardization.

Spectro, www.spectro.com

BR790-HD rework system aids in the removal, alignment, placement and soldering of BGAs, CSPs, ultra-fine-pitch QFPs, and other heat-sensitive SMDs. Has 1.3m pixel, split-vision optics and 15" high-res display. Component presentation nest is mounted to the optics’ X and Y drives; automates pickup and positioning of the component in the camera’s field of view and reduces handling of SMDs. Five separate input connectors allow positioning of K-type thermocouples. LCD touchscreen displays real-time temperatures and allows adjustment of top and bottom hot air heater settings. Includes edge-clamping system that adjusts to fit boards up to 21.6" x 19.7". Has 6-zone rapid IR under-heater. Capable of supplying up to 3600w of heating power.

Manncorp, www.manncorp.com

NanoClear stencil treatment is reportedly now 50% stronger. Reduces frequency of underside cleaning. Better performance from stencils with low aperture area ratios. Uses self-assembled monolayers with phosphonates that are compatible with common types of stencil alloys, including stainless steel, electroform, nickel, and e-polished stencils. Monolayers are fewer than 5nm thick and covalently bound to the surface.

Aculon, www.aculon.com

Indium9.91 no-clean solder paste is for package-on-package applications 0.3mm and larger. Rheology optimizes dipping and package retention. Reduces defects due to package warping; provides solderability; has long pot life, and provides consistent solder paste volumes. Can be used with SAC 305 and Sn63 alloys.

Indium, www.indium.com