535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Does not contain antimony.

Engineered Material Systems, www.emsadhesives.com

Sherlock 3.0 automated design analysis software is for analyzing, grading and certifying the expected reliability of products at the circuit card assembly level. Includes a global parts database with private cloud storage; 3D FEA model and 3D viewer for ICT and shock and vibration analysis; sub-assembly analysis to attach one or more printed circuit board subassemblies to the primary circuit board; improved result management functionality, and embedded failure rate models. 

DfR Solutions, www.dfrsolutions.com

SDR custom size desiccant drying and storage rooms control and trace moisture sensitive components, boards and assemblies. Modular enclosures accommodate feeder trolleys, WIP carts and PCB racks. Employ energy-efficient, dual wall insulated steel construction; enable rapid, oxidation-free drying at 40°-60°C and safe storage per J-STD-033C. U5000 Series Dry Unit is said to deliver 0.5% RH and closed-loop regeneration that responds to the atmosphere in the cabinet. Relevant process data are obtained with use of a 0.8% digital sensor. Data can be logged directly through RS232 with available software links.

Super Dry, www.totech.eu.com
 

Siplace Di-Series placement machines include digital vision systems, single and dual conveyors and multi-language station software. Available with one, two and four gantries. Siplace D1i, Siplace D2i and Siplace D4i place components down to 01005s. Include S-feeders. Component cameras have high-resolution; changeover tables are newly developed. Can accommodate three flexible head types: the 12-nozzle collect and place head, the 6-nozzle collect and place head, and the TwinHead.

ASM Assembly Systems, www.siplace.com