Spherolyte RDL / Pillar 2 process for high-speed plating of copper pillars and redistribution layers (RDLs) is a sulfuric acid-based three additive copper electrolyte system. Nonuniformity value – within wafer, die or/and profile – of the deposited copper structures, even over a range of applied current densities, is up to 17.5 ASD  (3.9 µm/min). Process control is analyzable through an online system for all additives. Is for flip-chip applications for various sizes of copper pillars (including µ-Pillars), especially for handhelds such as tablets or smartphones.

Atotech, atotech.com

Kapton SMT plastic film stencils reportedly permit clean and precise hole patterns. Come in 4, 5 and 6 mil thicknesses. Present flat coplanar printing surfaces for solder paste printing. Are designed for prototype assembly, and the pitch of the components is one or above. Absorb heat of laser-cutting process without producing ridges.

BEST Inc., www.solder.net

RX-6 high-speed compact modular mounter places components ranging from subminiature components to large ICs or odd-shaped parts. Is equipped with head units that pick components and place them on PWBs on both the rear and front sides; head units on the front and rear sides repeat picking up and placing components. IC component height and PWB size are increased; can support production such as mounting of LEDs or PoPs. Includes placement monitor analyze function.
RX-7 mounter places subminiature components on PWBs at high speed. Includes two super rotary heads equipped with 16 nozzles for picking up/placing each component on a PWB. Achieves 75,000 cph. Parallel head configuration is used for the heads. Camera inside head detects tombstoning or component absence.

Juki, www.jukiamericas.com

Coolspan thermally and electrically conductive adhesive film is thermosetting, epoxy-based, and silver-filled. Is used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. Can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. Is supplied in sheet form on a PET; is reportedly easy to handle when converting into preforms and when peeling from the carrier. Withstands Pb-free solder processing. Offers chemical resistance and high-temperature performance.

Rogers Corp., www.rogerscorp.com