Flip-Top tubs for Isopropyl Alcohol (IPA) wipes have lids that spring closed automatically. Are eco-friendly; reportedly reduce waste and emissions. Refill packs fit into Flip-Top tubs and disposable tubs. IPA wipes are available in two different grades: 99.8% pure IPA is for tape head cleaning, defluxing, fiber optics maintenance, and other light cleaning; 70% pure IPA has a slower evaporation rate; is for stencil cleaning to remove pastes and adhesives, oven cleaning, and general maintenance cleaning. Are both made of non-woven polyester material, which is low linting and tear and snag resistant.

Techspray, http://www.techspray.com

iico SMT placement machine places a variety of components, including chips, MELFs, electrolytic capacitors, SO, PLCC, QFP, QFN, TSOP, QFP, BGA, µBGA, LGA, CSP, connectors and odd-form SMDs, and can place from a minimum of 0.5 x 0.25 mm (0201) to 50 x 50 mm as standard. Built on the the EP600 and Progress6 platform. Features new encoders on the X and Y axis to improve accuracy, "smart" nozzles with a new magazine; new head fitted with an 8-position turret with optical sensors and high-resolution digital cameras. Includes flat screen monitor and control panel with latest software. Compatible with all Europlacer feeders (including ii-Feed) and equipment. For small volumes and prototypes.

Europlacer, www.europlacer.com

SCC conformal coat protects printed circuit boards from liquids, salts and other corrosive elements. Seals over, in and around all the elements on the board or device at a nano level. Protect PCBs against water, IPA, mixed salts, and other corrosive elements. Applied using a plasma process. Permits rework without masking or laser ablation.

Semblant, www.semblant.com

PS588 component programmer now comes with a second-generation 3D coplanarity vision system. After a device is programmed, the 3D vision system measures the leads of each device to ensure they are within specified tolerances before placed in output media. Reportedly drives down risk of product failures caused by manufacturing and handling defects. Measures x, y and z axes of the leads on a device to proof them against set acceptance specifications and criteria.

Data I/O, www.dataio.com