Super Gel 9 urethane-modified epoxy gel can be used for encapsulation of electronic parts and sealing optical components. Has Shore A hardness of about 5-10. Is reportedly ideal for retrieving components with a knife or razor blade. Can withstand rigorous thermal cycling and thermal/mechanical shock. Has two-to-one mix ratio by weight or volume, along with a low viscosity and exotherm enabling it to be cast in sections up to 2"-3" thick. Bonds to metals, glass, ceramics and many rubbers and plastics. Has working life of 7-9 hr. Resists water, oils and fuels. Service temp. range is -100° to +200°F. Is available in ½ pints, pints, quarts, gallons, 5 gal. container kits and gun dispensers.

Master Bond, www.masterbond.com 

RO-Control and RO-Soft 7 software simulate, control and document RO300 and RO400 series reflow and curing ovens and processes. RO-Control 7 controls and regulates oven parameters such as zone temperatures, feed rate and conveyor width. Automatically set up certain ovens and start production. Status messages displayed graphically, and incoming and outgoing boards are monitored. Auto-save feature regularly captures temperature and speed values in a CSV type file. Operator actions are logged, and software modules can be released to specific individuals. Based on temperature settings, product data and throughput expectations, RO-Control simulates expected temperature profile, and graphically compares to measured values and solder paste specifications. Both packages measure real temperature profiles directly on the PCB using thermocouples. Multiple measurements can be overlaid to detect deviations. All data can be exported as CSV and graphics. Both packages require Windows 7 and can be upgraded from older versions. Language support now includes Polish.

Essemtec, www.essemtec.com 

VT-X700 inline, automated 3D CT x-ray analyzes printed circuit boards, including those with hidden solder joints. Inspects solder quality on components from BGAs to chips, and through-hole devices. Inspections are performed at 5 sec. per field-of-view. Gauges PCB surface for each solder joint, compensating for warpage; performs cross-sectional analysis at slice-level locations. Has selectable resolutions of 10, 15, 20, 25 or 30µm combined with selectable numbers of x-ray projections (up to 128).

Omron, www.omron247.com/
 

VT-S500 has 3D image processing; analyzes topographical features of solder fillets. Is capable of performing solder inspections that mimic IPC guidelines. Software is capable of absorbing production inconsistencies and noise. Provides high-speed inspections and has dual-lane availability. Is available with camera magnifications of 10 or 15µm; is capable of processing PCBs up to 510 x 610mm (single-lane applications) or 510 x 300mm (dual-lane applications).

Omron, www.omron247.com/