KISS-105 is capable of inline selective soldering of printed circuit boards up to 28" x 36". Reportedly can handle the size and weight of large backplanes and other oversized products. When equipped with a topside preheater, it can achieve Class 3 solder joints on printed circuit boards with a thickness of up to 0.354". Large boards are processed in a 1" border frame that supports, locates and flattens the board. Frame mounted boards are conveyed into the system in a SMEMA manner where they are optically aligned, located and camped into position. After flux application, preheating elevates the topside board temperature to a set temperature and maintains the temperature throughout the soldering cycle. PCB remains stationary. Is equipped with “Super Quick” motion and closed-loop positioning feedback with linear encoders. Has offline programming software. Features include program-controlled conveyor width adjustment, positive PCB locating and flattening, fiducial alignment and skew correction.

ACE Production Technologies, www.ace-protech.com

Buzzard camera and illumination system for optical inspection of selective solder joints to be integrated into external test cells. Contains 4Mp camera with GigE interface, multispectral illumination, PC and software. Can be configured to optical test demands of each inspection system. Camera provides functionalities for image pre-processing. Multispectral illumination includes control, coverage of light spectrum from UV to IR, and high-contrast images of inspected solder joints and components. Includes TOM Line software for industrial applications; features a range of test functions, for example to evaluate plated through-hole solder joints, shorts or solder splashes. Software can be operated by a remote interface.

Goepel electronic, www.goepel.com