caLogo

New Products

SL automatic self‐loading 8mm feeder provides splice‐free continuous operation. Permits addition of a secondary reel supply in the same feeder at any time during operation, reducing or eliminating unnecessary material costs. Accepts strip‐tapes. Reportedly can be loaded in 10 sec. or less. Uses a new cover tape process that mitigates release of dust and debris inside the placement system. Is backwards compatible with entire line of Hitachi modular mounters back to the GXH‐1.

Hitachi High Technologies America, www.hitachi‐hta.com

 

 

 

IS-I-700 inline selective soldering system handles boards up to 700 x 700 mm (27.6 x 27.6"). Features SMEMA pass-through conveyor. ach solder pot comes with inert hot nitrogen atmosphere feature. Comes with micro jet fluxer for clean soldering results and low flux consumption. Optional large top and bottom side preheating system, controlled by pyrometer.

InterSelect, www.myInterSelect.de

IS-I-460 inline selective soldering system handles boards up to 460 x 460 mm (18 x 18"). Features SMEMA pass-through conveyor. ach solder pot comes with inert hot nitrogen atmosphere feature. Comes with micro jet fluxer for clean soldering results and low flux consumption. Optional large top and bottom side preheating system, controlled by pyrometer.

InterSelect, www.myInterSelect.de

ERO-500 reflow oven has five top and five bottom vertical heating zones, and one cooling zone. Uses plenum convection heating for uniform temperature profiling across the entire printed circuit board. Maximum temperature of 320°C. Compatible with most lead and lead-free solder paste profiles. For low- to medium-volume production runs. Status light tower included. Mesh belt or edge rail conveyor units available. Real-time graphic temperature profiler.

DDM Novastar, ddmnovastar.com

Model 8000x SMT screen printers have an advanced-design printing table, high-precision servo motors, adjustable stencil rails and one-touch conveyor-width adjustment to ease changeovers. Come with 2-D vision system.

ESE Co. Ltd.

 

CN-1751-4 underfill encapsulant is reportedly crack resistant; withstands flexing experienced by flexible printed circuitry or drops and shocks of thin printed circuit assemblies. Reportedly can withstand deformation without cracking; has a modulus higher than traditional reworkable underfills. Has a CTE of 48 ppm/°C. Viscosity is 900 cps. Can be reworked at 170° to 180°C to remove underfill fillet. Underfill residue is scraped off at 170° to 180°C.

Zymet, www.zymet.com
 

Page 439 of 730

Don't have an account yet? Register Now!

Sign in to your account