BR790-HD rework system aids in the removal, alignment, placement and soldering of BGAs, CSPs, ultra-fine-pitch QFPs, and other heat-sensitive SMDs. Has 1.3m pixel, split-vision optics and 15" high-res display. Component presentation nest is mounted to the optics’ X and Y drives; automates pickup and positioning of the component in the camera’s field of view and reduces handling of SMDs. Five separate input connectors allow positioning of K-type thermocouples. LCD touchscreen displays real-time temperatures and allows adjustment of top and bottom hot air heater settings. Includes edge-clamping system that adjusts to fit boards up to 21.6" x 19.7". Has 6-zone rapid IR under-heater. Capable of supplying up to 3600w of heating power.

Manncorp, www.manncorp.com

NanoClear stencil treatment is reportedly now 50% stronger. Reduces frequency of underside cleaning. Better performance from stencils with low aperture area ratios. Uses self-assembled monolayers with phosphonates that are compatible with common types of stencil alloys, including stainless steel, electroform, nickel, and e-polished stencils. Monolayers are fewer than 5nm thick and covalently bound to the surface.

Aculon, www.aculon.com

Indium9.91 no-clean solder paste is for package-on-package applications 0.3mm and larger. Rheology optimizes dipping and package retention. Reduces defects due to package warping; provides solderability; has long pot life, and provides consistent solder paste volumes. Can be used with SAC 305 and Sn63 alloys.

Indium, www.indium.com

Aquanox A8820 aqueous stencil cleaner is designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes. Removes common solder pastes and fluxes; is compatible with stencil cleaning equipment. No-foaming property is compatible with materials used in electronic assembly manufacturing and cleaning processes. Comes in one, five, and 55 gal. containers.

Kyzen, www.kyzen.com