UV2000 ultraviolet light curing oven encloses Fusion UV lamp system, resulting in an 8% reduction in noise output, less RF interference, and enhanced service access. Has lamp height adjustability of 50mm – 200mm, and includes standard light baffles. Convert from single-sided to double-sided oven with four additional parts. Uses UV lamps to initiate fast UV light polymerization of adhesives and coatings. Various UV beam widths available.

PVA, www.pva.net

Model 2651A High Power System SourceMeter Instrument is for testing high power electronics, semiconductors, and materials. Features broad dynamic range, capable of sourcing or sinking up to 2,000W of pulsed power (±40V, ±50A) or 200W of DC power (±10V@±20A, ±20V@±10A, ±40V@±5A).

Keithley Instruments, www.keithley.com

C-EVO uses environmentally friendly technology and includes a new plate heat exchanger, single electrical box, efficient blower wheel, touch screen controller, and newly designed steam generator. Is said to have a small equipment footprint. Updated design offers easier access, reduces noise, increases airflow, and improves temperature control.

Tenney, www.tenney.com

535-10M-1 UV cured adhesive is a low stress, lower glass transition temperature (Tg) version of 535-10M. Is nonconductive, and cures rapidly when exposed to high-intensity UV light. Features low outgassing. Contains no antimony. Is said to eliminate “crowning” (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in the head stack assembly. Can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

Engineered Material Systems, www.conductives.com