UV25 one-component UV curable material is for bonding, sealing, coating and encapsulation applications. Has a glass transition temp. of 186°C. Is serviceable between -60° and +500°F. Is optically clear with a refractive index of 1.55 at room temp. On exposure to a UV light source emitting at a wavelength of 320-365nm with an energy output of 20 to 40mW per cm², it cures in 20 to 30 sec. Contains no solvents or volatiles; features low shrinkage upon curing. Bonds well to glass, surface treated metals and plastics such as polycarbonates and acrylics. When used in potting applications, it can cure in section up to 0.100-0.120". At room temperature, it has a viscosity of 7,000-11,000cps.

Master Bond, www.masterbond.com

90iSC lead-free solder alloy is said to process much like a traditional SAC alloy but with superior temperature cycling performance, consistent with or better than conventional SnPb solders. Is a multi-component alloy based on traditional SAC but with improved temperature resistance and reliability characteristics. Has a temperature cycling range from -40° to 155°C, optimized creep resistance at high temperature, vibration and drop test performance comparable to SAC and other lead-free alloys and has printing and reflow behavior consistent with alternative lead-free materials. Is compatible with several Henkel lead-free and halogen-free flux systems.

Henkel, www.henkel.com/electronics

HFFR hexane-free flux remover is a fast-drying cleaning solvent. Eliminates low levels of n-Hexane. Is available in 400ml aerosol form with a brush or in 5L bulk containers.

Electrolube, www.electrolube.com

DB-1568-1 low-temperature cure die attach adhesive is for attaching semiconductor die in temperature-sensitive devices. Applications include smart cards, camera modules, and flex circuits. Is more than 90% cured after 30 min. at 80°C; has a dispensing work life greater than 48 hrs (measured as a 25% increase in viscosity. Is reportedly ideal for flexible applications with high peel strength. Can be cured in 1 min. at 180°C.

Engineered Material Systems, www.conductives.com