ProFlex selective laser soldering has an XYZ gantry, generous soldering areas, and comprehensive graphic user interface. Gantry can be scaled from 8" to 8' to meet most soldering application requirements. The 70 lb. capable gantry permits multiple tooling to be attached to the end effector, so a single head can perform multiple functions, or additional heads can be added to increase output, place paste and then solder, preheat (hot air) and then solder, and more. Comes in tabletop, rotary table, dual slide shuttle, inline conveyor, hover over top of a Bosch conveyor, and other configurations. Windows based control platform.

ProMation Inc., pro-mation-inc.com

A500 benchtop solder paste inspection system automatically finds fiducials, identifies pads, and retains height and volume data for each pad. Shows pads outside thresholds in real-time. Retains historical data. Offers 3-D views, with measurement speeds up to 17 cm²/sec. XY motion permits automatic scanning of PCB panels up to 300 x 300mm. Z-axis motion permits auto-focus of the sensor and board warpage compensation. Accepts Gerber.

VisionMaster, www.visionmasterinc.com

Wizard Stencil Stretch Frame system changed and tensions stencils using simple, adaptable components and readily-available shop air (compressed). Consists of two frame components plus the stencil foil. A patented molded plastic Container Frame holds the stencil foil for handling, mounting, and space-saving storage, using 64 to 80 contact points to hold the foil stencil in place, and protects workers from injuries during handling. When ready to mount for printing, the Container Frame and stencil are mounted in the adjustable, durable, lightweight aluminum frame assembly Stencil tension can be modified in all directions with the amount of air pressure applied. Requires less storage space (since stencil foils can be stored in their compact plastic Container Frames) and eliminates need for epoxy bonding of the stencil foil to a cast frame. Come in three sizes and three types of plastic composition for specific applications.

QTS, Inc., www.QTSframe.com

F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. Has negligible vertical flow, keeping the adhesive contained in defined areas. Copolymer prevents drips and dispensing inconsistencies. Adhesive placement is reportedly consistent from bond to bond. Temp. and time required depend on component materials, design, bond requirements, and operating environment. Adding pressure and increasing oven temperature and time improves adhesion. Min. processing temp. is 225°F (107°C).  A typical processing schedule is 275°F (135°C) for 10 min. under 5 psi.

Multi-Seals, www.multi-seals.com