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VT-RNSII inline post-reflow inspection system and VT-RNSII-ptH benchtop model now have faster shutter speeds and improved image processing to perform inspections 20% faster than the original series. Use Color Highlight system that provides 3-D information from a 2-D image; uses RGB LEDs in a dome configuration. 3-CCD camera system enhances solder shape recognition accuracy. Offer resolution of up to 10µm; support inspection of components as small as 01005 and 12 mil pitch. Optical Character Verification capability is standard. Have EzTS program generation software. Include models for paste inspection and pre-reflow component placement inspection.

Omron, www.omron247.com

ScanVision tool suite for boundary scan design visualization performs multi-board design visualization at the layout and schematic level. Consists of Layout Visualizer, Schematic Visualizer and Virtual Schematic Visualizer. Database is generated by importing individual design data and interconnection referencing. Tools include Cascon Board Merger and Cascon Component Explorer. Performs interactive cross-probing between schematic and layout, selective labeling of pins, components and circuits, and tracking of signal paths via multiple boards with dynamic switching. Enables operations such as test coverage analysis, hardware debugging or graphical fault display far above the board boundaries up to system level. Has System Cascon v. 4.6.1.

Goepel electronic, www.goepelusa.com

MC-400 benchtop pick-and-place machine places 0201s through 100 x 150mm SMDs. 01005 available. Has a placement rate of 3,000 pph. Picks from cut strips, reels, sticks and waffle trays. Has ±0.05mm accuracy and ±0.01mm repeatability. Includes remote diagnostics and full vision alignment. Has a placement area of 415 x 320mm.

Manncorp, www.manncorp.com 

Ultima TR2 series selective soldering and fluxing system, for soldering through-hole components and connectors to surface mount and mixed technology PCBs, incorporates a high-precision x-, y-, and z-axis drive that moves the PCB, rather than the solder pot, resulting in a lightweight construction that takes up 36” x 31” of table space. The 35 lb. solder pot and pump assembly features an integral nitrogen hood with a built-in micro-preheater for inerting solder site and stabilizing wave temperature. Feeds live video of soldering process to PC via standard bottom-side witness camera. Universal PCB holder with quick-release cam-locks handles boards up to 13” x 10”, while a larger model is available for 18” x 15” assemblies. Separate fluxer improves throughput (no waiting for soldering to finish before fluxing and vice versa) and keeps over-spray and sticky flux residue away from the soldering operation.

Manncorp, https://www.manncorp.com/selective-soldering/

ProBot is an automatic profiling system that verifies whether each printed circuit board is processed to specification in the reflow oven. Suspect PCBs can be sent to batch x-ray. Allows for more effective sampling. Is designed to fit virtually any reflow oven. Is highly modular; can specify desired features.

KIC, www.kicthermal.com

Sarcon 30QR is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W. Is available in roll or sheet form and can be die-cut, molded or extruded. Use for conductive insulator for semiconductors, compression joining material for thermistors and temperature sensors, as well as gap filler material for all types of heaters. This V-0 flame-retardant thin film is recommended for applications with operational temperatures that range from -60°C to +180°C.

Fujipoly America Corp., www.fujipoly.com

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