HTCX (Heat Transfer Compound Xtra) silicone-free thermal paste includes a dispersant in the formulation that reportedly increases thermally conductivity without increasing film thickness. Is smoother and provides higher thermal conductivity, lower oil bleed and lower evaporation weight loss. Is said to be humidity- and thermal cycling-resistant. For thermal coupling electrical and electronic components, and between surfaces for thermal conductivity and heat dissipation.

Electrolube, www.electrolube.com

Material Disclosure software protects trade secrets about products and raw materials while providing supply chain traceability. Can upload reporting templates such as EICC-GeSI to a secure central database to create reports from consolidated supplier data. Works to increase response times from suppliers and automates querying suppliers on a regular basis, as well as gathering and storing data. Collects data on raw materials, including gold, tantalum, tin and tungsten. Data are collected at the bill of material level down to the substance level throughout the supply chain.

Actio, www.actio.net

Infiniium 9000 H-Series high-definition oscilloscopes come in four models with bandwidths of 250 MHz, 500 MHz, 1 GHz and 2 GHz. Offer up to 12-bit vertical resolution, 16 times the quantization levels of traditional oscilloscopes with 8 bits of resolution. Standard memory up to 100 Mpts per channel. Use a combination of hypersampling and linear noise-reduction technology to provide noise levels reportedly three times lower than traditional 8-bit oscilloscopes. N2820A and N2821A AC/DC current probes offer sensitivity down to 50uA, with a maximum current range of 5A, for measuring current consumption of battery-powered mobile devices or integrated circuits.

Agilent Technologies, www.agilent.com/find/9000H

Thermoset SC-303, SC-309 and SC-320 thermally conductive silicone encapsulants are designed for thermal conductivity for electrical/electronic encapsulating applications. Are two-component systems designed to retain properties associated with silicones. Exhibit low shrinkage and stress on components as they cure, and maintain low viscosity. Are environmentally resistant and UL-rated; are composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Lord Corp., www.lord.com/electronicmaterials