Aimex IIS component placement platform features single or twin robot configuration. Handles up to 130 part types at a time, with components from 01005 (0402mm) to 74 x 74mm or 32 x 180mm. Maximum part height is 38.1mm. Handles PCBs sized 48 x 48mm to 774 x 686mm. Single or double conveyors. Placement heads can be exchanged without using any tools. Automatic calibration. Feeders can be exchanged during production without stopping the machine.

Fuji, http://www.fuji.co.jp

Rapido RPS3000 for high-speed programming and board test supports double-sided probing for up to 3000 nails. Non-volatile memories such as flash, MCU and programmable logic devices can be quickly programmed on-board. Enables combining programming tasks with test strategies such as boundary scan, processor emulation, chip embedded instruments or functional test.

Goepel, www.goepel.com

Wizard stencil storage racks hold stencil foils and frames designed for electronics materials printing. Provide safe storage using injection-molded guides at the top and bottom, and quick access from either side. Are rugged and durable, compact and space-efficient. manufactured using extruded aluminum. Mounted on locking casters for mobility. A 20” x 20” rack holds 300 stencils in 2’ x 5’ of floor space. Configurable to hold several vendors' frames.

QTS, Inc., www.QTSframe.com

Fast-curing CA-141 conductive adhesive is for stringing and bussing CIGS solar modules. Has been optimized for molybdenum and other substrates used in thin-film manufacturing. Is designed for thermal cycling and damp heat stability. Low Tg is suitable for manufacturing flexible modules using reel-to-reel manufacturing. Can be partially cured for 60 to 90 sec.; adhesive cure is completed during encapsulant lamination process. Reportedly has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons.

Engineered Conductive Materials, www.conductives.com