RO-Control and RO-Soft 7 software simulate, control and document RO300 and RO400 series reflow and curing ovens and processes. RO-Control 7 controls and regulates oven parameters such as zone temperatures, feed rate and conveyor width. Automatically set up certain ovens and start production. Status messages displayed graphically, and incoming and outgoing boards are monitored. Auto-save feature regularly captures temperature and speed values in a CSV type file. Operator actions are logged, and software modules can be released to specific individuals. Based on temperature settings, product data and throughput expectations, RO-Control simulates expected temperature profile, and graphically compares to measured values and solder paste specifications. Both packages measure real temperature profiles directly on the PCB using thermocouples. Multiple measurements can be overlaid to detect deviations. All data can be exported as CSV and graphics. Both packages require Windows 7 and can be upgraded from older versions. Language support now includes Polish.

Essemtec, www.essemtec.com 

VT-X700 inline, automated 3D CT x-ray analyzes printed circuit boards, including those with hidden solder joints. Inspects solder quality on components from BGAs to chips, and through-hole devices. Inspections are performed at 5 sec. per field-of-view. Gauges PCB surface for each solder joint, compensating for warpage; performs cross-sectional analysis at slice-level locations. Has selectable resolutions of 10, 15, 20, 25 or 30µm combined with selectable numbers of x-ray projections (up to 128).

Omron, www.omron247.com/
 

VT-S500 has 3D image processing; analyzes topographical features of solder fillets. Is capable of performing solder inspections that mimic IPC guidelines. Software is capable of absorbing production inconsistencies and noise. Provides high-speed inspections and has dual-lane availability. Is available with camera magnifications of 10 or 15µm; is capable of processing PCBs up to 510 x 610mm (single-lane applications) or 510 x 300mm (dual-lane applications).

Omron, www.omron247.com/

MYCenter 2.1 software improves SMT production control and efficiency. Three modules cover machine programming, data import and material handling, all unified into a redesigned single user interface that tracks thousands of parts while handling engineering changes, component deliveries and machine program revisions.

Provides a live database connection, allowing multiple users to work in parallel with real-time overviews of machine libraries. Displays nozzle size, tape pitch and width and landing pad information, ensuring correct part handling, orientation and placement. Convert bill-of-material (BoM) and Gerber data into ready-to-run machine programs. Material handling module gives real-time information on every individual reel, stick and tray. This makes it possible to track each carrier’s exact location, quantity or feeding parameters as it is used in different parts of the factory. Can be used alone or integrated into an ERP system.

Micronic Mydata, www.mydata.com