Sherlock-300F benchtop automated optical inspection system handles components as small as 01005s. PCB assemblies are fed into the machine on a built-in conveyor, eliminating the drawer design typical of benchtop AOI. All program setup and operation is done directly on a touchscreen display using multi-touch gestures.
Generates inspection programs from pick-and-place files or CAD data import. Can be used after stencil printing for 2D solder paste inspection, after placement for component presence, placement and value verification, and after reflow or wave soldering for solder joint and final assembly inspection. Automatically adjusts for board warp and flexible substrates.

Manncorp, www.manncorp.com/aoi/sherlock-300f/

ABI BoardMaster 8000 Plus is for testing and fault-finding on almost any kind of PCB.

Includes:

• Two Board Fault Locator modules, with 128 test channels for multiple test methods for fault diagnosis and functional testing of digital ICs (in-circuit/out-of-circuit), IC connections status, and voltage acquisition, V-I Curve testing of components on unpowered boards.
• Analog IC Tester for in-circuit functional testing of analog ICs and discrete components (no programming or circuit diagrams needed). Fully configurable V-I Tester for detection of faults on unpowered boards.
• Multiple Instrument Station with 8 high specification test and measurement instruments in one compact module (Frequency Counter, Digital Storage Oscilloscope, Function Generator, Digital Floating Multimeter, Auxiliary PSU, and Universal I/O).
• Triple Output Variable Power Supply provides required supply voltages to the unit under test.

Comes in a rugged transportable case that also contains a Windows PC.

Saelig, www.saelig.com

TestWay software assesses defect opportunities and identifies possible consequences of inadequate testability and test coverage on a new design. Analyzes each stage of the design-to-delivery workflow. Checks ROHS, reliability, DPMO, BSDL file validation to guide component selection. Verifies electrical DfT guidelines. Includes standard checks and customer’s specific checks. Optimizes test probe placement according to test strategy definitions, estimates test coverage, models the cost, and calculates production yield and TL9000 initial return rates. Estimates test coverage using theoretical models for a range of test and inspection strategies. Exports CAD data into native format usable by assembly machines, AOI, automated x-ray, in-circuit testers, flying probe testers and boundary scan testers. Can read completed test program or test report and compare the coverage between the estimated and measured analysis.

Aster Technologies, www.aster-technologies.com   

VS Series vacuum soldering systems feature fast heating and cooling rates, easy profile setup and editing, and data logging. Support use of different gases, formic acid and microwave plasma. All offer a small footprint, and said to reduce solder joints voids. Supports processes such as plasma cleaning and gas exchange for advanced packaging through controlled use of gases during the soft-soldering process at temperatures up to 450C, for oxide-free and void-free connection of chip and substrate. Permit flux-free soldering and use of solder preforms. Degassing and drying can be integrated into a single process. Models include VS320, VS160UG, and VS160S.

Rehm, rehm-group.com