MC-LEDV3 pick-and-place machine features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour per IPC-9850. Accommodates flexible strips, circular boards for LED bulbs, and long LED tube boards up to 70" (1800mm) long. Places standard and domed LEDs from 1 x 0.5mm to 8 x 8mm, with positive air pressure and Teflon-coated nozzles to aid release of "sticky" components. Feeders specially designed for LED assembly.

Manncorp, www.manncorp.com

Elite performs part library teaching and various recognition tests offline under the recognition environment identical to that of a chip mounter. Is said to improve parts placement quality and increase productivity of the machine by minimizing machine operation loss caused by the part registration and the possibility of defective recognition.

Samsung Techwin, www.samsung-smt.com

Excen chipshooter is rated at 120,000 cph (optimum). Features rotary modular head, side-view vision, of pre- and post-part placement monitoring, mixed production of different boards, nonstop changeover of device types, and auto-splicing and autoloading. Is 1.25m long.

Samsung Techwin, www.samsung-smt.com

QFusion fuses traditional burn-in and HASS within a single system. Has a footprint of 81.5” x 38.4” x 102”. Has 6 compartments, each with a vibration table, and provides a thermal ramp rate of 60°C/min. average. Employs hot and cold temperature, rapid thermal ramps and repetitive shock vibration. Features increased energy level in the lower frequency bands, which manifests unwanted weaknesses in a product. HASS screens failures that may have gone undetected during traditional burn-in testing processes. Subjects product to outer margins of temperature, rapid thermal cycling, and vibration testing—simultaneously—to uncover design weaknesses.

Qualmark, qualmark.com