ROI Calculator determines the cost of performing rework and repairs associated with solder contamination in wave solder operations. Determines amount of defects. Input data for shifts, days and working weeks per year.

Solderlab.com, www.solderlab.com/cost_of_rework

SFX5212 I/O module provides independently programmable I/O channels, and reportedly processes voltages up to 30V. Increases test coverage for non-boundary scan circuits or peripheral signals with higher signal voltage by combining structural and functional test procedures on a single platform. In addition to increasing test quality, test costs can be reduced by saving separate process steps.

Goepel Electronic, http://www.goepel.com

DDF Innova Direct Die Feeder converts Assembléon’s pick-and-place machine from a high-speed chipshooter into a high-speed flip-chip bonder, feeding devices directly from up to 300-mm wafers. Conversion permits controlled die bonding speeds up to 15,000 components per hour at maximum accuracy, and passive component placements up to 121,000 cph. Handles system-in-package, multichip module, flip-chips and embedded passive and active components. Supplies bare die directly from up to 300mm (12") wafers in flip chip (bumps down) or direct die (bumps up) mode. Wafer mapping ensures that only known-good-dies with sizes from 0.7mm (any edge), are presented to the machine.

Assembléon, www.assembleon.com

UV15 is used for bonding, coating and sealing. Is a 100% reactive epoxy-based UV curable material. Contains no solvents nor other volatiles. Is free of oxygen inhibition. Cures quickly when exposed to UV light with a wavelength range between 320nm and 365nm. Typically cures in thicknesses of a few microns to 0.015-0.020 in. in 15 to 30 sec. or fewer. Cures by a cationic reaction and produces bonds that reportedly have lower shrinkage (1-2%) and higher temp. resistance than most UV systems. Tg is 90°-95°C with a straight UV cure. When post-cured for 30 min. at 125°C, Tg is 125-130°C. Service temp. range is -80°F to +350°F. Resists chemicals, including water, acids, bases, fuels and many solvents.

Master Bond, www.masterbond.com