Master Bond LED401 adhesive, sealant, coating and encapsulant cures tack-free under exposure to a 405nm wavelength light source, without any oxygen inhibition. Is for applications involving heat-sensitive substrates. Viscosity is 100,000-150,000cps. Has cure times of 15 to 30 sec. or fewer in thinner sections; can be readily cured in sections up to 1/8 in. thick. Offers resistance to water, many acids, bases and oils. Has a volume resistivity exceeding 1014ohm-cm and a temperature range of -60° to +250°F. Has a shelf life of six months at room temperature without exposure to light, in its original containers.

Master Bond, www.masterbond.com  

MT8870A universal wireless test set has test capability for up to eight user equipment devices in a single mainframe without the need for external switching. Basic module includes an integrated vector signal analyzer, vector signal generator, and multi-core processor. Can configure a mainframe with up to four modules with four VSAs and four VSGs. Implements test capabilities for multiple formats through the addition of VSA and VSG software options, with current support ranging from Bluetooth and Wi-Fi to LTE and 802.11ac. Can be configured with one to four VSA/VSG modules, supporting 10 MHz to 6 GHz, as well as the 160 MHz bandwidth. Each module has two duplex and two simplex RF connectors. GPIB and Ethernet control of the VSA/VSG modules are available.

Anritsu Company, http://www.anritsu.com/en-US/

X8011 PCB comes with a link to the verification station for ease of analysis. Unspecified defects can be automatically pinpointed and re-examined in detail. XMC analysis software allows convenient operation, containing several automatic analyses such as BGA, QFN and inspection, and void calculation. The verification terminal link is identical to the inline system’s. All data and images of the type of defect can be stored and called up over the traceability system. Defects that evade conclusive identification can be directly and automatically pinpointed for detailed examination; i.e., with an inclined view or zoom enlargements.

Viscom, www.viscom.com

ABI Sentry counterfeit IC detector uses a combination of electronic parameter settings (voltage, frequency, source resistance and waveform) to generate a PinPrint for each pin of the IC being checked. Compares electrical signature of known components with suspect components. Can detect missing or incorrect dies, lack of bond wires, inaccurate pin-outs and pin impedance variations. Pass or fail results are returned after testing. Device library can be built by adding specific known good devices. Each device can have documents associated with it, such as photos of device markings and data sheets. Contains hardware required to analyze electrical characteristics of ICs with up to 256 pins. 256 pins+ devices can be tested by rotating the device (BGA, QFP) to permit all pins to be learned and compared. Is supplied with four 48-pin dual inline zero insertion force sockets. Weighs 8 lbs.

Saelig Co., www.saelig.com