Sarcon 25GR-T2d conformable thermal interface medium is for low and high-volume production applications. The reinforced 0.25mm thick TIM is for tight tolerance die-cut operations. When placed between a heat source and a nearby heat sink, gap filler pad provides a thermal conductivity of 1.5 W/m°K and a thermal resistance as low as 0.33 °Cin²/W. Handles operational temperatures between -40°C and +150°C. Comes in pre-cut sheets up to a max. size of 200mm x 400mm.

Fujipoly America, www.fujipoly.com

Rapido multisite inline programmer is for high-speed in-system programming of non-volatile memory devices such as Flash, serial EEPROM, micro controller units and programmable logic devices. Provides double-sided probing with up to 900 nail probes and gang programming of up to 16 sites. Available applications include FPGA-assisted programming, core-assisted programming through a JTAG or non-JTAG debug interface of a processor, in-application programming, and programming via boundary scan. Targets for programming applications are NOR, NAND, and eMMC with parallel or serial interface, as well as on-chip memory on microcontrollers and PLD and FPGA devices. Options can be added to incorporate board test applications, to accommodate extensions, to program through CAN, LIN or FlexRay interfaces, and for communication with pick-and-place feeders and with PASS/FAIL sorters, for example. Is based on Scanflex.

Goepel electronic, http://www.goepelusa.com/

iHawk Xpress has an improved transport to handle lead frames up to 100mm wide. Bonding accuracy improved to 3µm, and novel GoCU technology enables faster operation with copper wire. Ensures bonding wire is clamped in place and automatically rethreaded after a break, minimizing downtime and improving productivity.

ASMPT, www.asmpacific.com

OptiCon XI-Pilot 3.0 x-ray inspection system software enables higher image recording speed at increased sensibility. Compensates for PCB warpage or automatic stability control of image sequence. Detects and compensates PCB slag during inspection, for true to height solder layer reconstruction. Determines whether entire assembly or each partial circuit of a value should be compensated. Uses laser triangulation sensor determine PCB warpage. Compensates for PCB slag directly in the recorded images using software algorithm. Automatically detects changes in x-ray image chain and recalibrates images chain at lower deviations of acceptable tolerances. Reportedly ensures image geometry characteristics as well as intensity (grey values) are situated in an adjustable tolerance range.

Goepel Electronic, www.goepel.com