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PCBRM100 benchtop rework station has top- and bottom-focused convective heating said to virtually eliminate copper dissolution on plated through-hole components on high thermal mass assemblies. Solder contact time is reportedly almost instantaneous before a component is removed or replaced. Features include 24” x 24” board carrier, programmable x,y,z axes, 28” x 28” top and bottom preheater, barrel cleaning system and 90 lb. pot with stable, thermally balanced wave.

Air-Vac Engineering, www.air-vac-eng.com

Kern MLB 50-3N moisture analyzer supports GLP/ISO record-keeping data consisting of time, date and sample identification number. Moisture content is determined as a percent of weight loss from the starting weight and displayed from 0% to 100%. Readout down to 0.001g or 0.01% moisture. Dry mass is displayed from 100% to 0% as residual weight from the starting weight. Uses a 400W halogen heater. Temperature range is 50°C to 160°C, maximum weighing capability of 50g, reproducibility 0.003g and linearity ±0.003g. Four heating profiles – standard, soft, fast and step – based on properties of material being tested.

Tovatech, www.tovatech.com

Advanced Aluminum Conveyor Stand introduces wide-stance leveling pads, along with a mounting arrangement that allows leveling adjustment with pads bolted to the floor. Uses a leveling pad assembly mounted external to the stand leg, rather than a bolt threaded into the leg. Permits visual confirmation of remaining adjustment thread; allows leveling-pad assembly to be removed from the leg and replaced, without lifting the stand. Leveling pads conform to uneven floors, while a wrench stabilizer on the threaded shank allows easy adjustment. Leveling pad uses a threaded shank that prevents socket pullout, while retaining full swivel capability for the pad.

Conveyor Technologies, www.conveyortechltd.com

Reflow Process Index is designed to provide maximum quality and throughput from SMT reflow ovens. Helps manage reflow ovens to consistently maximize desired results. Provides process deficiency information to help correct defect issues quickly. Is an automatic system that, once programmed, works in the background without operator involvement. Shares all pertinent process and production data in real-time; automatically profiles every PCB; provides instant alarm for out-of-spec situations; automatic SPC charting, including Cpk; process traceability down to individual PCBs; prevents human error, such as production of the wrong PCBs or wrong oven recipe settings (barcode required).

KIC, www.kicthermal.com

PrinTEK I series benchtop SMT printers feature a synchronized 4-cam liftoff system, magnetic array table with locking pin-plates to easily tool the printed circuit board position, and rugged and accurate 3D via precision x, y, and theta anti-backlash adjustment heads. Basic printer handles PCBs up to 18" x 18"; large versions handle 18" x 24", and 24" x 36" boards.  Optional patented dual squeegee gantry head and dual video microscope alignment system.   

Transition Automation, www.transitionautomation.com 

Sentry SMT pick-and-place on-board vision system has two modules: SIM and EPV. SIM (strobed inspection module) AOI system ensures no misplaced boards will be sent to the oven. EPV module (embedded process verification) evaluates errors detected by the SIM module. Process is recorded photographically in real time. SIM system consists of several single modules within the line, including high-speed focus cameras with integrated stroboscopic illumination. A master template of the assembled board to be produced is stored by the software. Board is scanned after screen printing to obtain master image, including 2- or 3-D paste inspection. Subsequent scan occurs between chip and IC assembly, then image is laid over master template and compared. SIM checks exact position of components on solder paste; component presence, tombstones, polarity, and dropped components. Requires no programming. EPV can be used as a standalone module or with SIM.

Juki, www.jas-smt.com

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