X5 Prof printer contains EKRA technology, such as iROCS (rapidly oscillating cleaning system), Dual iPAG (integrated paste and glue dispensers), and iQUESS (quick exchange squeegee system). Has an 8 sec. cycle time and an EKRA Simplex touch screen interface.

Asys Group, www.asys-group.com

ESA Coach is an evaluation and training kit supporting embedded system access technologies. Demonstration board enables the practical training of ESA technologies such as boundary scan, processor emulation test, and chip embedded instruments by means of respective tutorials; allows for the development and validation of individual IP. Includes a microcontroller with ARM core, an FPGA, various boundary scan circuits, NAND and NOR Flash, DDR2-SDRAM, a color display, and diverse operating elements. Demonstration board provides an extension connector and various fault switches to verify the single test operations’ diagnosis ability. Also contains a demo version of System Cascon Release 4.6, VarioTAP, and ChipVORX models for processor emulation or controlling FPGA embedded instruments.

Goepel electronic, www.goepel.com

OCRMax is a tool for optical character recognition and verification applications. Can use across all In-Sight vision system and VisionPro vision software platforms. Can handle character variations, text skew, proportional fonts and variable string lengths. Reportedly has superior character segmentation capability; takes each character line and splits it into individual regions that contain one character. Can handle distorted, touching and variably spaced characters; can accommodate uneven surfaces and lighting variations.

Cognex, www.cognex.com/OCR

Loctite UF3810 underfill reportedly provides high reliability, while permitting easier reworkability. Is halogen-free, completely reworkable, and has a glass transition temperature (Tg) of 100°C, delivering thermal cycling reliability for wafer-level CSP and PoP devices. Is suited for handheld communication and entertainment applications. Delivers drop and shock protection and improved thermal cycling reliability for fine-pitch (0.5mm pitch and below) area array devices. Cures quickly at 130°C.

Henkel, www.henkel.com/electronics