3-D MID automatic inspection system inspects after manufacture of the 3-D MID carrier and entire 3-D MID product. Detects extraneous metallization deposition, separations, short circuits or conductor cracks, missing solder resist, component presence, polarity, correctness and position. Comes with 8M camera.

Viscom, www.viscom.com

Eco-Stencil RF is a water-based batch stencil cleaner that is non-flammable and low VOC. Is a drop-in replacement for isopropyl alcohol and other solvents commonly used in rinse-free batch stencil cleaning systems. Is a solvent and DI water blend that removes a variety of pastes and adhesives. Can be used as manual and under-stencil cleaner. Is halide-free and compliant with California CARB, REACH and WEEE initiatives. Does not contain RoHS restricted substances.

Techspray, www.techspray.com

TS5440 Series Microshot Needle Valve now includes an upgraded seal with a more robust material; reportedly extends the valve life by at least 300%. Permits the valve to handle more abrasive fluids; is ideal for use in harsh environments. Is designed to dispense low to medium viscosity material with precise deposits over a wide range of shot and bead sizes down to a fraction of a µL. Has an internal spring return; valve is adaptable for use with time/pressure controllers. A short opening stroke provides fast, positive shut-off. Includes an external stroke control adjustment. A stainless steel air cylinder version has been added to the series.

Techcon Systems, www.techconsystems.com

HS70XL inline SPI handles printed circuit boards up to 22 lbs (10kg). Features sensor head camera, timing conveyor belt, and four sets of motors. Uses dual CPUs to handle data. Measuring speed is 80cm2/sec. at 20x10 micron resolution, and 40cm2/sec. at 13x7 micron resolution. Inspects smaller than 01005 pads and sizes as small as 100u microns.

Parmi, www.parmi.com