NexJet system jetting technology contains Genius jet cartridge, a one-piece jet removable without tools. Has built-in memory to store usage data such as number of cycles and cartridge type. Includes software control of jetting process; accommodates both low- and high-viscosity fluids and a range of fluids for applications such as flip chip underfill, chip-scale package, ball grid array, package-on-package underfill, precise coating, and adhesive dispensing. Cartridge dispenses up to 50 million cycles before replacement is necessary, depending on application. Memory stores usage data that is communicated to dispenser; notifies operator when correct cartridge is installed or needs replacement.

Nordson Asymtek, www.nordsonasymtek.com

No. 959 is a 300ºF electrically-heated vertical conveyor oven used for curing electronic parts. Dimensions measure 36" x 89" x 115". Uses a 40KW heating element and a 6000 CFM, 5-HP recirculating blower. Features 4" insulated walls, aluminized steel interior and exterior, motor-operated vertical lift door at the loading/unloading opening and two independent doors. Includes 27 product carrier trays, each 30" x 14", supported at each side by a roller chain, driven by a ½-HP drive motor, controlled by a variable frequency drive. Controls include a digital temperature controller, manual reset excess temperature controller with separate contactors, recirculating blower airflow safety switch, and a tower light to indicate machine status. Built to JIC/NEMA 12 standards. 

The Grieve Corp., www.grievecorp.com

DB-1590 is a solder replacement in for crystalline silicon solar modules using thinned silicon or plated bus bars. Is optimized for conductivity and stability on various substrates when cured at 200°C. Is said to gel in 5 sec. or less at 200°C, developing sufficient strength to withstand the applied stresses induced by the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. Rheology optimized for dispensing, damp heat resistance and conductivity stability on tin, SnAg and Ag-plated ribbons. Is stable on OSP treated copper and nickel bus bars.

Engineered Conductive Materials, www.conductives.com

Novagard 800-230, 800-305, and 800-400 UV curable staking compounds are used as conformal coatings, potting compounds, inks, encapsulating and gasketing compounds and gels. UV 800-230 fast UV curing, single-component sealant is solvent-free; exhibits controlled rheology, no oxygen inhibition, has no corrosive byproducts, and cures quickly to solid rubber with UV irradiation at room temperature. UV 800-305 UV/dual cure sealant and adhesive is a noncorrosive, single-component silicone translucent paste sealant; cures to a solid rubber at room temperature. Exhibits controlled rheology and no oxygen inhibition. RTV 800-400 UV cure sealant is a noncorrosive, single-component silicone translucent paste sealant.

Novagard Solutions, www.novagard.com