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SN100C P810 D4 is designed for use in vacuum reflow with nitrogen. Is a high-reliability no-clean Pb-free solder paste optimized to deliver excellent reflow characteristics; generally can be reflowed with a profile similar to that commonly used with SAC 305 and SAC 405 with 240°C peak. Reduces voiding to less than 1% in measured void area. Has excellent wetting behavior. Is a compliant alloy that provides high-impact strength.

Nihon Superior, www.nihonsuperior.co.jp/english

FX SL AOI inspection system reportedly has more than twice the inspection speed of previous generation systems. Magnification options include 8, 12, and 25 µm/pixel. Delivers automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is well suited for high-volume and high-mix manufacturing environments; is capable of inspecting 01005 components. Uses a standard package library.

Nordson YESTech, http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx

ProDEK dynamic print process control is said to enable real-time continuous alignment adjustments and cleaning frequency adaptation to enhance throughput and yield and limit operator intervention. Uses paste offset (alignment) data feeds from the SPI to monitor a configurable quantity of PCBs, sending an independently corrected forward and reverse offset to the printer, which then adjusts paste on pad alignment in real-time. Using barcode tracking technology, guarantees printed and inspected board synchronization. Monitors high area warning counts from SPI data feeds, as potential indicators of excessive or insufficient understencil cleaning. Automatically adapts cleaning frequency to suit current process conditions, optimizing understencil cleaning and introducing more stability while significantly reducing consumables usage. Retrofittable to DEK printers, and compatible with CyberOptics, Koh Young and Parmi SPI.

DEK, www.dek.com

YSM40 high-density modular surface mounter adopts a 4-beam, 4-head layout on a compact platform with a width of 1m. Has a mounting speed of more than 100,000 cph. Is for small- to mid-sized printed circuit boards. Has 4- or 2-beam layouts, three types of heads, and a dual-lane conveyor layout. Includes automatic tray supply carriage and electric-powered ZS Feeder with a non-stop insertion/extraction function.

Yamaha Motor Co. Ltd., http://www.yamaha-motor.co.jp

FLXHD automated duplication system for e-MMC devices uses 40 sockets in parallel for a throughput of over 700 parts per hour. Has a simplified touchscreen and intuitive graphical user interface. Has no changeover time associated with downloading large files when switching from one job to another. Has a desktop footprint.

Data I/O, www.dataio.com/FLXHD

 

Hydron WS 325 cleaning agent is for water-soluble defluxing spray-in-air inline and batch cleaning applications. Can be applied at low concentrations (3% to 5%). Penetrates capillary spaces underneath low standoff components where DI-water-only applications can no longer provide reliable cleanliness levels. Is a mild formulation gentle on sensitive materials and solder joints.

Zestron, www.zestron.com

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