Board Merger enables automatic generation of a project database, while maintaining original signal designations and board characteristics. Debugging is facilitated and diagnostic information quality is reportedly improved. Handles each board as an individual object with bequeathing properties. Connections between single objects are initiated by referencing maintaining the original net designation. I/O modules can be inscribed into the principle as adapters. If modules of the same type are used, the whole process is handled through duplicating. Is integrated as standard in the System Cascon development package starting with version v. 4.6.

Goepel electronic, www.goepel.com 

Copper Glass-Coated Micro Wire features glass insulation for use in semiconductor wire bonding. Is a replacement to traditional copper bonding wire or gold wire. Is cast, not drawn, to enable a soft metal core with a high strength, ultra-fine glass coating. Is said to eliminate anti-oxidation, enabling a longer shelf life. Supports larger spools, for simpler materials management. Protects against shorts since the wire is coated and cannot make contact. Scale to 4 microns.

RED Micro Wire, redequipment.com

Vision System Alignment provides fiducial location (used to align the PCB to the stencil in X/Y/Theta) and post-print inspection (used to detect over and under print). Uses a high-resolution 1024 x 768 pixel resolution camera system. Fiducial location function features pattern recognition to locate fiducials on the PCB and stencil. Includes multi-stage sub pixeling algorithms. 2-D Post-Print Inspection function reportedly ensures proper solder paste application to the printed circuit board with a field of view of 63 mm² and an inspection shot rate of < 220 ms. Grayscale-based inspection detects excess solder paste and insufficient solder paste.

Milara, www.milarasmt.com

M.O.L.E. MAP 3 free software moves from separate programs to one that now supports all current ECD instrument platforms. Has nine environments: user selectable combinations of M.O.L.E. and RIDER pairing that separate one profiling data acquisition activity from another. Environments are basic profiling; WaveRider; OvenRider; OvenChecker; MiniMOLE rH; solar metallization and others.

ECD, www.ecd.com